HS1-6254RH-Q Intersil Corporation, HS1-6254RH-Q Datasheet - Page 3

• Manufacturer Part Number: HS1-6254RH-Q
• Description: Rad-hard Ultra High Frequency Npn Transistor Array
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
INTERFACE MATERIALS:
Glassivation:
Top Metallization:
Substrate:
Backside Finish:
Metallization Mask Layout
NOTE: Pad numbers correspond to the 16 lead pinout.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
52 mils x 52.8 mils x 15 mils 1 mil
1320 m x 1340 m x 381 m 25.4 m
Type: Nitride
Thickness: 4k
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8k
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16k
UHF-1X Bonded Wafer, DI
Silicon
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Å
0.5k
Å
Å
Å
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
0.5k
3
4
5
6
3
0.8k
Å
Å
7
2
HS-6254RH
1
HS-6254RH
8
9
16
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
ADDITIONAL INFORMATION:
Worst Case Current Density:
Transistor Count:
Floating
3.04 x 10
5
10
15
5
A/cm
2
14
13
12
11