SPB18P06PG Infineon Technologies Corporation, SPB18P06PG Datasheet - Page 2

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SPB18P06PG

Manufacturer Part Number
SPB18P06PG
Description
P-channel Mosfets Power-transistor
Manufacturer
Infineon Technologies Corporation
Datasheet

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Rev 1.3
1)
FCB is vertical without blown air.
Parameter
Thermal characteristics
Thermal resistance,
junction - case
Thermal resistance,
junction - ambient,leaded
SMD verson, device on PCB:
Electrical characteristics, at T
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Transconductance
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm
j
=25 °C, unless otherwise specified
Symbol Conditions
R
R
R
V
V
I
I
R
g
DSS
GSS
fs
(BR)DSS
GS(th)
thJC
thJA
thJA
DS(on)
minimal footprint
6 cm
V
V
1000 µA
V
T
V
T
V
V
|V
I
D
page 2
j
j
GS
DS
DS
DS
GS
GS
=25 °C
=150 °C
=-13.2 A
DS
=V
=-60 V, V
=-60 V, V
=0 V, I
=-20 V, V
=-10 V, I
|>2|I
2
2
(one layer, 70 µm thick) copper area for drain connection.
cooling area
GS
, I
D
|R
D
D
=-250 µA
=-
D
DS(on)max
GS
GS
DS
=-13.2 A
=0 V,
=0 V,
=0 V
1)
,
min.
-2.1
-60
5
-
-
-
-
-
-
-
-
Values
typ.
-0.1
101
-10
-10
10
3
-
-
-
-
-
SPB18P06P G
max.
-100
-100
1.85
130
62
62
40
-4
-1
-
-
Unit
K/W
K/W
V
µA
nA
mΩ
S
2008-02-18

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