BGA6589 Philips Semiconductors (Acquired by NXP), BGA6589 Datasheet - Page 3
BGA6589
Manufacturer Part Number
BGA6589
Description
BGA6589; Mmic Wideband Medium Power Amplifier
Manufacturer
Philips Semiconductors (Acquired by NXP)
Datasheet
1.BGA6589.pdf
(12 pages)
Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
Note
1. T
THERMAL CHARACTERISTICS
Note
1. T
STATIC CHARACTERISTICS
T
2003 Sep 19
V
I
P
T
T
P
R
I
S
j
S
SYMBOL
stg
j
SYMBOL
SYMBOL
S
tot
D
th j-s
= 25 C; V
MMIC wideband medium power amplifier
s
s
is the temperature at the soldering point of pin 2.
is the temperature at the soldering point of pin 2.
S
= 9 V; R
DC device voltage
DC supply current
total power dissipation
storage temperature
operating junction temperature
maximum drive power
thermal resistance from junction to solder point T
supply current
PARAMETER
bias
PARAMETER
= 51
PARAMETER
unless otherwise specified.
CONDITIONS
RF input AC coupled
T
s
70 C; note 1
3
CONDITIONS
s
70 C note 1
CONDITIONS
MIN.
73
65
TYP.
MIN.
81
Product specification
6
150
800
+150
150
15
VALUE
MAX.
MAX.
BGA6589
100
89
V
mA
mW
dBm
C
C
UNIT
UNIT
UNIT
K/W
mA