MT28C256532W18S Micron Semiconductor Products, Inc., MT28C256532W18S Datasheet - Page 20

• Manufacturer Part Number: MT28C256532W18S
• Description: 256Mb Multibank Burst Flash 32Mb/64Mb Async/page Cellularram Combo, 88-Ball Fbga
• Manufacturer: Micron Semiconductor Products, Inc.

NOTE:
Data Sheet Designation
Advance:
ming, and timing, please refer to the MT28F644W18 data sheet at
MT45W2MW16FPA and MT45W4MW16FPA data sheets at http://www.micron.com/cellularram.
09005aef80bcd58d
MT28C256564W18S_A.fm - Rev. A, Pub 6/03 EN
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.27mm per side.
SEATING PLANE
E-mail: [e-mail], Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
For additional documentation concerning Flash and CellularRAM features, functional descriptions, program-
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Infineon Technologies outside the U.S.
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE
PRE-REFLOW DIAMETER
IS Ø 0.35
0.10 C
8.80
(4X)
88X
This data sheet contains initial descriptions of products still under development.
4.40 ±0.05
0.10
Micron, the M logo, and the Micron logo are trademarks and/or service marks of Micron Technology, Inc.
BALL A8
Ø
0.35
1.025 ±0.075
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
2.80 ±0.05
All other trademarks are the property of their respective owners.
9.00 ±0.10
5.60
0.80
TYP
C L
32Mb/64Mb ASYNC/PAGE CellularRAM COMBO
4.50 ±0.05
Figure 5: 88-Ball FBGA
C L
6.00 ±0.05
0.80
TYP
BALL A1 ID
BALL A1
20
12.00 ±0.10
256Mb MULTIBANK BURST FLASH
®
Micron Technology, Inc., reserves the right to change products or specifications without notice..
SOLDER BALL MATERIAL:
62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø 0.30mm SOLDER MASK DEFINED
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
0.25 ±0.05
1.40 MAX
www.micron.com/flash
BALL A1 ID
©2003 Micron Technology, Inc
ADVANCE
and the