MPC8280 Motorola, MPC8280 Datasheet - Page 42
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MPC8280
Manufacturer Part Number
MPC8280
Description
PowerQUICC II Family Hardware Specifications
Manufacturer
Motorola
Datasheet
1.MPC8280.pdf
(76 pages)
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Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
42
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Soldermask
1.27 mm Pitch
Polymide Tape
Figure 13. Pinout of the 480 TBGA Package (View from Top)
MPC8280 PowerQUICC II™ Family Hardware Specifications
(Oxidized for Insulation)
Copper Heat Spreader
Figure 14. Side View of the TBGA Package
Glob-Top Dam
Glob-Top Filled Area
View
Die
Wire Bonds
Attach
Die
Copper Traces
Cavity
Etched
Pressure Sensitive
Adhesive
MOTOROLA
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