BSP75-AE6327 Infineon Technologies Corporation, BSP75-AE6327 Datasheet
BSP75-AE6327
Related parts for BSP75-AE6327
BSP75-AE6327 Summary of contents
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Smart Lowside Power Switch Features Logic Level Input Input protection (ESD) Thermal shutdown (with restart) Overload protection Short circuit protection Overvoltage protection Current limitation Application All kinds of resistive, inductive and capacitive loads in switching applications C compatible power switch ...
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Maximum Ratings =25°C unless otherwise specified Parameter Continuous drain source voltage (overvoltage protection see page 4) Drain source voltage for short circuit protection Load dump protection V LoadDump =400ms; IN=low or ...
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Electrical Characteristics Parameter and Conditions °C, unless otherwise specified j Static Characteristics Drain source clamp voltage Off state drain current Input ...
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Parameter and Conditions °C, unless otherwise specified j Protection Functions Thermal overload trip temperature Thermal hysteresis Unclamped single pulse inductive energy I =0 =32 V D(ISO) bb Inverse Diode Continuous source drain voltage V ...
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Block diagram Terms HITFET V IN Input circuit (ESD protection) IN ESD-ZD I Source ESD zener diodes are not designed for DC current. Semiconductor Group Inductive and overvoltage output clamp ...
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Maximum allowable power dissipation tot C P [W] tot 2 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0 On-state resistance 0.7 A; ...
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Typ. on-state resistance 0 25° 2000 1500 1000 500 Typ. short circuit current ...
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Application examples: Status signal of thermal shutdown by monitoring input current Semiconductor Group HITFET µC µ thermal shutdown Page 8 HITFET ® BSP 75A 1998-11-25 ...
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... Package and ordering code all dimensions in mm SOT223/4 BSP75 Definition of soldering point with temperature T upper side of solder edge of device pin 4. Pin 4 Edition 7.97 Published by Siemens AG, Bereich Halbleiter Vetrieb, Werbung, Balanstraße 73, 81541 München © Siemens AG 1997 All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, The information describes a type of component and shall not be considered as warranted characteristics ...