BSP77 Infineon Technologies Corporation, BSP77 Datasheet - Page 2
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BSP77
Manufacturer Part Number
BSP77
Description
Fully Protected Switch
Manufacturer
Infineon Technologies Corporation
Datasheet
1.BSP77.pdf
(10 pages)
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Thermal resistance
junction - ambient:
@ min. footprint
@ 6 cm
junction-soldering point:
1 Device switched on into existing short circuit.
2 Not tested, specified by design.
3 V
4 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 70µm thick) copper area for d
Maximum Ratings at T
Parameter
Drain source voltage
Drain source voltage for short circuit protection
Continuous input current
-0.2V
V
Operating temperature
Storage temperature
Power dissipation
T
Unclamped single pulse inductive energy
Load dump protection V
V
R
Electrostatic discharge voltage
according to MIL STD 883D, method 3015.7 and
EOS/ESD assn. standard S5.1 - 1993
DIN humidity category, DIN 40 040
IEC climatic category; DIN IEC 68-1
connection. PCB mounted vertical without blown air.
IN
C
IN
L
Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
= 6
= 85 °C
< -0.2V or V
= 0 and 10 V, t
2
V
, V
IN
cooling area
A
= 13.5 V
10V
IN
> 10V
d
= 400 ms, R
4)
j
LoadDump
= 25°C, unless otherwise specified
(Human Body Model)
I
3)
= 2
= V
A
,
+ V
2)
Page 2
S
1)
R
R
Symbol
V
V
I
T
T
P
E
V
V
IN
j
stg
thJA
thJS
DS
DS(SC)
tot
AS
LD
ESD
-55 ... +150
-40 ...+150
40/150/56
| I
no limit
Value
IN
125
250
3.8
72
17
42
42
50
E
2
|
2
2001-07-20
BSP 77
K/W
K/W
Unit
V
mA
°C
W
mJ
V
kV