FMM5822X Eudyna Devices, Inc., FMM5822X Datasheet - Page 11

• Manufacturer Part Number: FMM5822X
• Description: K-Band Power Amplifier MMIC
• Manufacturer: Eudyna Devices, Inc.

RF-IN
■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
1194
2760
2640
2555
280
205
120
Ｎｏ ｔ ｅ : Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2).
0
0
0
120
120
V D D 1
V G G 1
636
620
(V G G 2 )
750
V D D 2
1155
1155
V D D 3
11
Chip Size : 3570
Chip Thickness : 70±20um
Bonding Pad Size :
RF-Pad : 120um x 80um
VGG-Pad : 80um x 80um
VDD-Pad : 100um x 100um
K-Band Power Amplifier MMIC
±30um x 2760±30um
V D D 4
V D D 5
3075
3075
3450
3450
FMM5822X
3570
3570
250
1380
0
2760
2510
R F - O U T