BULD25 Power Innovations Limited, BULD25 Datasheet - Page 9

• Manufacturer Part Number: BULD25
• Description: NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
• Manufacturer: Power Innovations Limited

D008
plastic small-outline package
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
P R O D U C T
D008
6,20 (0.244)
5,80 (0.228)
1,75 (0.069)
1,35 (0.053)
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
0,203 (0.008)
0,102 (0.004)
0,79 (0.031)
0,28 (0.011)
4,00 (0.157)
3,81 (0.150)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
I N F O R M A T I O N
1
8
7° NOM
3 Places
5,00 (0.197)
4,80 (0.189)
2
7
(see Note A)
Pin Spacing
1,27 (0.050)
6 Places
6
3
MECHANICAL DATA
0,50 (0.020)
0,25 (0.010)
NPN SILICON TRANSISTOR WITH INTEGRATED DIODE
0,51 (0.020)
0,36 (0.014)
5
4
8 Places
x 45°NOM
0,229 (0.0090)
0,190 (0.0075)
BULD25D, BULD25DR, BULD25SL
JULY 1994 - REVISED SEPTEMBER 1997
7° NOM
4 Places
5,21 (0.205)
4,60 (0.181)
1,12 (0.044)
0,51 (0.020)
Designation per JEDEC Std 30:
PDSO-G8
4° ± 4°
MDXXAA
9