S2006FS221V Teccor Electronics, Inc., S2006FS221V Datasheet - Page 13

• Manufacturer Part Number: S2006FS221V
• Description: Thyristor Product Catalog
• Manufacturer: Teccor Electronics, Inc.

Reliability Stress Tests
The following table contains brief descriptions of the reliability tests commonly used in evaluating Teccor product reliability on a peri-
odic basis. These tests are applied across product lines depending on product availability and test equipment capacities. Other tests
may be performed when appropriate.
Flammability Test
For the UL 94V0 flammability test, all expoxies used in Teccor encapsulated devices are recognized by Underwriters Laboratories
©2002 Teccor Electronics
Thyristor Product Catalog
Temperature and Humidity
Temperature Cycle
High Temperature
High Temperature
[Liquid to Liquid]
Thermal Shock
Resistance to
AC Blocking
Solderability
Storage Life
Solder Heat
[Air to Air]
Autoclave
Test Type
Bias Life
Rated V
T
A
T
T
T
T
= 121 °C, rh = 100%, P = 15 psig,
A
A
A
A
Steam aging = 1 hr to 8 hrs,
= 85 °C to 95 °C, rh = 85% to
= 0 °C to 100 °C, t
= 150 °C, t = 250 to 1000 hrs
Bias @ 80% Rated V
T
= 100 °C to 150 °C, Bias @
solder
T
Typical Conditions
T
t = 24 hrs to 168 hrs
DRM
A
t = 168 to 1008 hrs
cycles = 10 to 500
A
cycled = 10 to 20
= -65 °C to 150 °C,
(320 VDC max)
= 260 °C, t = 10 s
, t = 24 hrs to 1000 hrs
= 245 °C, Flux = R
100%
95%
txfr
= 10 s,
DRM
P - 9
Evaluation of the reliability of
product under bias conditions
and elevated temperature
Evaluation of the effects on
devices after long periods of
storage at high temperature
Evaluation of the reliability of non-
hermetic packaged devices in
humid environments
Evaluation of the device’s ability
to withstand the exposure to
extreme temperatures and the
forces of TCE during transitions
between temperatures
Evaluation of the device’s ability
to withstand the sudden changes
in temperature and exposure to
extreme temperatures
Accelerated environmental test to
evaluate the moisture resistance
of plastic packages
Evaluation of the device’s ability
to withstand the temperatures as
seen in wave soldering
operations
Evaluation of the solderability of
device terminals after an
extended period
Test Description
MIL-STD-750, M-1040
MIL-STD-750, M-1031
EIA / JEDEC, JESD22-A101
MIL-STD-750, M-1051,
EIA / JEDEC, JESD22-A104
MIL-STD-750, M-1056
EIA / JEDEC, JESD22-A102
MIL-STD-750, M-2031
MIL-STD-750, M-2026,
ANSI-J-STD-002
Standards
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