MC10EP32MNR4G ON Semiconductor, MC10EP32MNR4G Datasheet - Page 10

IC DIVIDER 2 3.3/5V ECL 8-DFN

MC10EP32MNR4G

Manufacturer Part Number
MC10EP32MNR4G
Description
IC DIVIDER 2 3.3/5V ECL 8-DFN
Manufacturer
ON Semiconductor
Series
10EPr
Datasheet

Specifications of MC10EP32MNR4G

Logic Type
Divide-by-2
Number Of Elements
1
Number Of Bits Per Element
1
Reset
Asynchronous
Count Rate
4GHz
Trigger Type
Positive, Negative
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TFDFN Exposed Pad
Logic Family
MC10EP32
Supply Voltage (max)
6 V
Supply Voltage (min)
- 6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Output Current
50 mA, 100 mA
Output Voltage
3490 mV to 3815 mV
Propagation Delay Time
350 ps
Supply Current
30 mA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Direction
-
Timing
-
Lead Free Status / Rohs Status
 Details
Other names
MC10EP32MNR4G
MC10EP32MNR4GOSTR
0.15 (0.006) T
0.15 (0.006) T
−T−
0.10 (0.004)
SEATING
PLANE
L
U
U
S
S
PIN 1
IDENT
D
2X
L/2
C
8
1
−V−
A
8x
4
5
K
G
0.10 (0.004)
REF
−U−
B
PACKAGE DIMENSIONS
PLASTIC TSSOP PACKAGE
http://onsemi.com
M
CASE 948R−02
T
DT SUFFIX
U
TSSOP−8
DETAIL E
ISSUE A
S
10
DETAIL E
V
S
F
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. TERMINAL NUMBERS ARE SHOWN FOR
6. DIMENSION A AND B ARE TO BE DETERMINED
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
REFERENCE ONLY.
AT DATUM PLANE -W-.
DIM
M
A
B
C
D
F
G
K
L
MILLIMETERS
MIN
2.90
2.90
0.80
0.05
0.40
0.25
0
0.65 BSC
4.90 BSC
_
MAX
3.10
3.10
1.10
0.15
0.70
0.40
6
_
0.031
0.002
0.016
0.010
0.114
0.114
MIN
0.026 BSC
0.193 BSC
0
INCHES
_
0.122
0.122
0.043
0.006
0.028
0.016
MAX
6
_

Related parts for MC10EP32MNR4G