MCP1406 Microchip Technology, MCP1406 Datasheet - Page 14

• Manufacturer Part Number: MCP1406
• Description: 6A High-Speed Power MOSFET Drivers
• Manufacturer: Microchip Technology

MCP1406/07
8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S]
DS22019A-page 14
Note:
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
A3
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
N
1
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length §
Contact-to-Exposed Pad §
2
D
A1
Dimension Limits
E
A
NOTE 2
Microchip Technology Drawing No. C04–122, Sept. 8, 2006
EXPOSED PAD
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
0.80
0.00
3.90
2.20
0.35
0.50
0.20
MIN
K
MILLIMETERS
b
1.27 BSC
0.20 REF
5.00 BSC
6.00 BSC
NOM
0.85
0.01
4.00
2.30
0.40
0.60
—
8
BOTTOM VIEW
D2
e
MAX
1.00
0.05
4.10
2.40
0.48
0.75
—
2
© 2006 Microchip Technology Inc.
N
1
L
NOTE 1
E2