MCP1406 Microchip Technology, MCP1406 Datasheet - Page 15

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MCP1406

Manufacturer Part Number
MCP1406
Description
6A High-Speed Power MOSFET Drivers
Manufacturer
Microchip Technology
Datasheet

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0
8-Lead Plastic Dual In-line (PA) – 300 mil Body (PDIP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
β
eB
E1
E
Dimension Limits
§
Units
2
1
A2
E1
B1
eB
A1
A
E
D
L
B
n
p
c
α
β
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
8
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
3.56
0.38
6.10
9.14
3.18
0.20
1.14
0.36
7.87
2.92
7.62
5
5
MILLIMETERS
NOM
MCP1406/07
8
α
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
p
A2
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15
DS22019A-page 15

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