MCP1630-E/P Microchip Technology, MCP1630-E/P Datasheet - Page 25
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MCP1630-E/P
Manufacturer Part Number
MCP1630-E/P
Description
PIC High Speed Pulse Width Modulator, -40C to +125C, 8-PDIP, TUBE
Manufacturer
Microchip Technology
Datasheet
1.MCP1630-EP.pdf
(32 pages)
© 2007 Microchip Technology Inc.
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
MCP1631/HV/MCP1631V/VHV
e
A2
E1
Units
A2
A1
E1
L1
D
N
A
E
e
L
c
φ
b
E
c
MIN
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
8°
–
DS22063A-page 25
φ
L