MCP1630-E/P Microchip Technology, MCP1630-E/P Datasheet - Page 26
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MCP1630-E/P
Manufacturer Part Number
MCP1630-E/P
Description
PIC High Speed Pulse Width Modulator, -40C to +125C, 8-PDIP, TUBE
Manufacturer
Microchip Technology
Datasheet
1.MCP1630-EP.pdf
(32 pages)
MCP1631/HV/MCP1631V/VHV
DS22063A-page 26
20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
E1
e
A2
Units
A2
A1
E1
L1
N
D
A
E
e
L
φ
c
b
E
c
0.05
4.30
0.45
0.19
MIN
0.80
6.40
0.09
0°
–
L1
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
6.50
0.60
20
–
–
–
–
–
Microchip Technology Drawing C04-088B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
4.50
6.60
0.75
0.20
0.30
8°
φ
L