MCP1700-3302E/MB Microchip Technology, MCP1700-3302E/MB Datasheet - Page 13

• Manufacturer Part Number: MCP1700-3302E/MB
• Description: Low Quiescent Current LDO
• Manufacturer: Microchip Technology

6.0
6.1
The MCP1700 is most commonly used as a voltage
regulator. It’s low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
FIGURE 6-1:
6.1.1
6.2
6.2.1
The internal power dissipation of the MCP1700 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(1.6 µA x V
calculate the internal power dissipation of the LDO.
EQUATION
The
temperature specified for the MCP1700 is +125
estimate the internal junction temperature of the
MCP1700, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (R
ambient for the SOT23 pin package is estimated at
230
I
150 mA
2003 Microchip Technology Inc.
P
V
V
OUT
Input Voltage Range = 2.3V to 3.2V
LDO
IN(MAX)
OUT(MIN)
P
°
V
1.8V
C/W.
LDO
OUT
maximum
= LDO Pass device internal power dissipation
APPLICATION CIRCUITS &
ISSUES
Typical Application
Power Calculations
Package Type = SOT23
V
=
V
IN
= Maximum input voltage
IN
APPLICATION INPUT CONDITIONS
POWER DISSIPATION
JA
OUT
= LDO minimum output voltage
). The following equation can be used to
V
maximum = 3.2V
). The thermal resistance from junction to
IN MAX
C
1 µF Ceramic
typical = 1.8V
OUT
GND
V
I
OUT
continuous
OUT
MCP1700
Typical Application Circuit.
–
= 150 mA maximum
V
OU T MIN
V
IN
operating
V
(2.3V to 3.2V)
IN
I
1 µF Ceramic
OUT MAX
C
IN
junction
°
C
.
To
EQUATION
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
EQUATION
EQUATION
EQUATION
T
temperature.
P
R
T
P
T
T
R
T
P
R
T
T
T
AMAX
A(MAX)
A
J(MAX)
J(MAX)
J(RISE)
J
J(RISE)
TOTAL
D(MAX)
TOTAL
JA
JA
JA
= Junction Temperature.
= Ambient temperature.
= Thermal resistance from junction to ambient.
= Thermal resistance from junction to ambient.
= Thermal resistance from junction to ambient.
= Maximum ambient temperature.
T
= Total device power dissipation.
= Maximum device power dissipation.
= Maximum continuous junction
= Maximum continuous junction
= Maximum ambient temperature.
J MAX
= Maximum device power dissipation.
= Rise in device junction temperature over
= Rise in device junction temperature over
P
temperature.
D MAX
the ambient temperature.
the ambient temperature.
T
J RISE
T
=
J
=
P
=
TOTAL
=
---------------------------------------------------
T
T
J RISE
P
J MAX
D MAX
R
R
MCP1700
+
–
JA
JA
T
T
A
A MAX
R
+
T
DS21826A-page 13
JA
AMA X