MCP1700-3302E/MB Microchip Technology, MCP1700-3302E/MB Datasheet - Page 18

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MCP1700-3302E/MB

Manufacturer Part Number
MCP1700-3302E/MB
Description
Low Quiescent Current LDO
Manufacturer
Microchip Technology
Datasheet
MCP1700
3-Lead Plastic Transistor Outline (TO) (TO-92)
DS21826A-page 18
Number of Pins
Pitch
Bottom to Package Flat
Overall Width
Overall Length
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
1
p
E1
n
Dimension Limits
R
B
D
L
c
Units
E1
D
R
B
n
p
A
L
c
1
MIN
2
.130
.175
.170
.085
.500
.014
.016
3
4
2
INCHES*
NOM
.050
.143
.186
.183
.090
.555
.017
.019
3
5
3
MAX
.155
.195
.195
.095
.610
.020
.022
6
4
MIN
12.70
3.30
4.45
4.32
2.16
0.36
0.41
4
2
MILLIMETERS
NOM
2003 Microchip Technology Inc.
14.10
1.27
3.62
4.64
2.29
0.43
0.48
4.71
3
5
3
MAX
A
15.49
4.95
4.95
3.94
0.56
2.41
0.51
6
4

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