NCP370 ON Semiconductor, NCP370 Datasheet - Page 9

• Manufacturer Part Number: NCP370
• Description: Positive and Negative Overvoltage Protection
• Manufacturer: ON Semiconductor

Thermal Shutdown protection
shutdown protection turns off the internal MOSFETs in
order to instantaneously decrease the device temperature.
The thermal threshold has been set at 150°C FLAG then
goes low to inform the MCU.
on as soon the device temperature falls below 120°C.
engages the thermal shutdown again until the fault event
disappears.
ESD Tests
the Input pin. A 1 mF (I.E Murata GRM188R61E105KA12D)
must be placed close to the IN pins. If the IEC61000−4−2 is
not a requirement, a 100 nF/25 V must be placed between IN
and GND.
(Contact) at the input per IEC61000−4−2 (level 4).
electrostatic discharge waveform.
In case of internal overheating, the integrated thermal
As the thermal hysteresis is 30°C, the MOSFETs will turn
If the fault event is still present, the temperature increase
The NCP370 conforms to the IEC61000−4−2, level 4 on
The above configuration supports 15 kV (Air) and 8 kV
Please refer to Figure 7 for the IEC61000−4−2
250
200
150
100
50
0
0
100
Figure 6. Copper heat Spread Area
COPPER HEAT SPREAD AREA (mm
PCB cu thk 2 oz
qJA Curve with
Power Curve with
PCB cu thk 2 oz
200
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300
9
PCB cu thk 1 oz
400
qJA Curve with
PCB Recommendations
PCB rules must be respected to properly evacuate the heat
out of the silicon.
package should be connected to an isolated PCB area to
increase the heat transfer if necessary.
potential or GND other than the isolated extra copper
surface.
PAD1, Figure 6 shows the copper area required with respect
to R
Power Curve with
PCB cu thk 1 oz
Since the NCP370 integrates the 1. 3A N−MOSFETs,
From an applications standpoint, PAD1 of the NCP370
In any case, PAD1 should be not connected to any other
To assist in the design of the transfer plane connected to
qJA
500
.
Figure 7. I
2
)
600
700
peak
2.5
2
1.5
1
0.5
0
= f(t)/IEC61000−4−2
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