NCP512 ON, NCP512 Datasheet
NCP512
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NCP512 Summary of contents
Page 1
... PMOS power transistor, resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP512 has been designed to be used with low cost ceramic capacitors. The device is housed in the micro−miniature SC70−5 surface mount package. Standard voltage versions are 1.5, 1.8, 2.5, 2 ...
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... Storage Temperature 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL−STD−883, Method 3015 Machine Model Method 200 V 2. Latch−up capability (85 C) "200 mA DC with trigger voltage. NCP512 Description Symbol V in ...
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... Decreasing, Output Turns Off, Logic Low) Output Voltage Temperature Coefficient 3. Maximum package power dissipation limits must be observed. T J(max qJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. NCP512 ( 1 out(nom.) ...
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... out INPUT VOLTAGE (V) in Figure 6. Ground Pin Current vs. Input Voltage NCP512 TYPICAL CHARACTERISTICS 3.020 3.015 3.010 3.005 3.000 2.995 2.990 2.985 75 100 125 −60 −40 −20 Figure 3. Output Voltage vs. Temperature 3.0 V out = 1 ...
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... I −100 out −200 in C out 0 100 200 300 400 500 TIME (ms) Figure 10. Load Transient Response 3.5 3.0 2.5 2.0 1.5 1.0 0 NCP512 TYPICAL CHARACTERISTICS 4 1 out out 200 100 0 −100 100000 1000000 0 50 100 150 Figure 9. Line Transient Response ...
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... IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current actually the difference between the input current (measured through the LDO input pin) and the output current. NCP512 DEFINITIONS Line Regulation The change in output voltage for a change in input voltage. ...
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... P tot + [ gnd (I out ) ] ) [ out ] * I out or V inMAX + output current is needed then the ground current from the data sheet is 40 mA. For an NCP512 (3.0 V), the maximum input voltage will then be 6.12 V. http://onsemi.com 7 T J(max ...
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... Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection NCP512 interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process ...
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... ORDERING INFORMATION Output Voltage* Device NCP512SQ15T1 NCP512SQ18T1 NCP512SQ25T1 NCP512SQ27T1 NCP512SQ28T1 NCP512SQ30T1 NCP512SQ31T1 NCP512SQ33T1 NCP512SQ50T1 *Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. NCP512 Nominal Marking LCK 1.5 1.8 LCL 2.5 LCM 2.7 LCN 2.8 LCO 3.0 LCP 3.1 LFO 3.3 LCQ 5.0 LCR http://onsemi.com 9 Package Shipping SC70− ...
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... D 0.004 0.012 0.10 0.30 G 0.026 BSC 0.65 BSC H −−− 0.004 −−− 0.10 J 0.004 0.010 0.10 0.25 K 0.004 0.012 0.10 0.30 N 0.008 REF 0.20 REF S 0.079 0.087 2.00 2.20 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NCP512/D ...