TDF5140 Philips Semiconductors, TDF5140 Datasheet - Page 18

• Manufacturer Part Number: TDF5140
• Description: Brushless DC motor drive circuit
• Manufacturer: Philips Semiconductors

Philips Semiconductors
Product specification
Brushless DC motor drive circuit
TDF5140A
SOLDERING
Plastic dual in-line packages
B
Y DIP OR WAVE
The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for
more than 5 s. The total contact time of successive solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it
must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s.
1999 March 15
18