74AUP1G07 NXP Semiconductors, 74AUP1G07 Datasheet - Page 11

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74AUP1G07

Manufacturer Part Number
74AUP1G07
Description
Low-power buffer
Manufacturer
NXP Semiconductors
Datasheet

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13. Package outline
Fig 9. Package outline SOT353-1 (TSSOP5)
74AUP1G07_2
Product data sheet
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT353-1
max.
1.1
A
0.1
A 1
0
1
5
1.0
0.8
A 2
y
IEC
e
Z
0.15
A 3
e 1
D
0.30
0.15
b p
0
b p
4
3
MO-203
0.25
0.08
JEDEC
c
w
REFERENCES
M
D
2.25
1.85
(1)
scale
Rev. 02 — 14 June 2007
1.5
1.35
1.15
E
(1)
SC-88A
JEITA
0.65
e
c
3 mm
e 1
1.3
A 2
A 1
2.25
H E
2.0
Low-power buffer with open-drain output
H E
E
0.425
detail X
L
0.46
0.21
L p
L
L p
A
PROJECTION
EUROPEAN
(A 3 )
0.3
v
X
v
M
74AUP1G07
0.1
w
A
A
0.1
© NXP B.V. 2007. All rights reserved.
y
ISSUE DATE
00-09-01
03-02-19
0.60
0.15
Z
(1)
SOT353-1
7
0
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