74AUP2G14GW,125 NXP Semiconductors, 74AUP2G14GW,125 Datasheet
74AUP2G14GW,125
Specifications of 74AUP2G14GW,125
935279987125
Related parts for 74AUP2G14GW,125
74AUP2G14GW,125 Summary of contents
Page 1
Low-power dual Schmitt trigger inverter Rev. 3 — 22 July 2010 1. General description The 74AUP2G14 provides two inverting buffers with Schmitt trigger action which accept standard input signals. They are capable of transforming slowly changing input signals into ...
Page 2
... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Temperature range Name −40 °C to +125 °C 74AUP2G14GW −40 °C to +125 °C 74AUP2G14GM −40 °C to +125 °C 74AUP2G14GF −40 °C to +125 °C 74AUP2G14GN −40 °C to +125 °C 74AUP2G14GS 5. Marking Table 2. Marking ...
Page 3
... NXP Semiconductors 7. Pinning information 7.1 Pinning 74AUP2G14 GND 001aad704 Fig 4. Pin configuration SOT363 7.2 Pin description Table 3. Pin description Symbol Pin 1A 1 GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. 74AUP2G14 Product data sheet 74AUP2G14 GND ...
Page 4
... NXP Semiconductors 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
Page 5
... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I power-off leakage current OFF ΔI additional power-off leakage OFF current I supply current CC ΔI additional supply current CC C input capacitance ...
Page 6
... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter ΔI additional power-off leakage OFF current I supply current CC ΔI additional supply current CC = −40 °C to +125 °C T amb V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current ...
Page 7
... NXP Semiconductors 12. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions propagation delay nA to nY; see propagation delay nA to nY; see propagation delay nA to nY; see propagation delay nA to nY; see 74AUP2G14 Product data sheet Figure ...
Page 8
... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions pF and power dissipation MHz capacitance [1] All typical values are measured at nominal V [ the same as t and PLH PHL [3] All specified values are the average typical values over all stated loads. ...
Page 9
... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance External voltage for measuring switching times. EXT Fig 8. Test circuit for measuring switching times Table 10. ...
Page 10
... NXP Semiconductors Table 11. Transfer characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions V hysteresis voltage ( Figure Figure 15. Waveforms transfer characteristics T− Fig 9. Transfer characteristic Fig 11. Typical transfer characteristics; V 74AUP2G14 Product data sheet …continued − see Figure 9, T− ...
Page 11
... NXP Semiconductors Fig 12. Typical transfer characteristics; V 16. Application information The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula add P = additional power dissipation (μW); add f = input frequency (MHz rise time (ns fall time (ns ΔI CC(AV) Average Δ ...
Page 12
... NXP Semiconductors (1) Positive-going edge. (2) Negative-going edge. Fig 13. Average function ≈ ---------------- - f = × Average values for variable a are given in Fig 14. Relaxation oscillator Table 12. Variable values Supply voltage 1.1 V 1.5 V 1.8 V 2.8 V 3.3 V 74AUP2G14 Product data sheet 0.3 ΔI CC(AV) (mA) 0.2 0.1 0 0.8 1.8 2 ...
Page 13
... NXP Semiconductors 17. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 15. Package outline SOT363 (SC-88) 74AUP2G14 Product data sheet scale 2.2 1.35 2 ...
Page 14
... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. 6× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
Page 15
... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 17 ...
Page 16
... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
Page 17
... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
Page 18
... NXP Semiconductors 18. Abbreviations Table 13. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 19. Revision history Table 14. Revision history Document ID Release date 74AUP2G14 v.3 20100722 • Modifications: Added type number 74AUP2G14GN (SOT1115/XSON6 package). ...
Page 19
... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
Page 20
... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 21. Contact information For more information, please visit: For sales office addresses, please send an email to: 74AUP2G14 Product data sheet 20 ...
Page 21
... NXP Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Functional description . . . . . . . . . . . . . . . . . . . 3 9 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 13 Waveforms ...