HCTS191DMSR Intersil Corporation, HCTS191DMSR Datasheet
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HCTS191DMSR
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HCTS191DMSR Summary of contents
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... CMOS/SOS Logic Family. The HCTS191MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS191DMSR HCTS191KMSR HCTS191D/Sample HCTS191K/Sample HCTS191HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. ...
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FF0 FF1 FF2 ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL TPLH VCC = 4.5V TPHL VCC = 4. TPLH VCC = 4.5V TPHL VCC = 4. TPLH VCC = 4.5V TPHL VCC = ...
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TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Capacitance Power CPD VCC = 5.0V 1MHz Dissipation Input Capacitance CIN VCC = 5.0V 1MHz Output Transition TTHL VCC = 4.5V Time TTLH Maximum Operating FMAX VCC = 4.5V ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current (Source) IOH ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTE: 1. Alternate Group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...
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Die Characteristics DIE DIMENSIONS: 104 x 86 mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY < 2 A/cm BOND PAD SIZE: ...