HCTS193D Intersil Corporation, HCTS193D Datasheet
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HCTS193D
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HCTS193D Summary of contents
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... SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCTS193DMSR HCTS193KMSR HCTS193D/Sample HCTS193K/Sample HCTS193HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCTS193MS Synchronous 4-Bit Up/Down Counter ...
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Functional Diagram CPU FF0 CPD 8 GND 16 VCC 3 Q0 FUNCTION CLOCK UP Count Up Count Down H Reset X Load Preset Inputs X H ...
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Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL CPU to Qn TPLH VCC = 4.5V TPHL VCC = 4.5V CPD to Qn TPLH VCC = 4.5V TPHL VCC = 4. TPLH VCC = 4.5V TPHL VCC = ...
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TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Pulse Width MR TW VCC = 4.5V Recovery Time TREC VCC = 4. CPU, CPD Recovery Time TREC VCC = 4. CPU, CPD NOTE: 1. The parameters listed ...
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TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25 PARAMETER ICC IOL/IOH CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B ...
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... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...
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AC Timing Diagrams I/FMAX CPU OR CPD TPHL VS QN FIGURE 1. CLOCK TO OUTPUT DELAYS AND CLOCK PULSE WIDTH CPU OR CPD TPLH FIGURE 3. PARALLEL ...
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Die Characteristics DIE DIMENSIONS: 104 x 86 mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY < 2 A/cm BOND PAD SIZE: ...