LM3532TMX-40ANOPB National Semiconductor Corporation, LM3532TMX-40ANOPB Datasheet - Page 6

• Manufacturer Part Number: LM3532TMX-40ANOPB
• Description: High Efficiency White Led Driver With Programmable Ambient Light Sensing Capability And I2c-compatible Interface
• Manufacturer: National Semiconductor Corporation

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Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended
to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics
table.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level Chip Scale
Package (AN-1112), available at www.national.com.
Note 4: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
T
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 6: Junction-to-ambient thermal resistance (θ
JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1 array of thermal vias. The ground plane
on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/36 µm (1.5 oz/1oz/1oz/1.5 oz). Ambient temperature in simulation is 22°C
in still air. Power dissipation is 1W. The value of θ
depending on PCB material, layout, and environmental conditions. In applications where high maximum power dissipation exists special care must be paid to
thermal dissipation issues.
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Unless otherwise specified, conditions for typical specifications are: V
Note 8: SCL and SDA must be glitch-free in order for proper brightness control to be realized.
Note 9: The human body model is a 100 pF capacitor discharged through 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7).
Note 10: All Current sinks for the matching spec are assigned to the same Control Bank.
Note 11: Matching is determined by the following formula: 2 × (ILED2 - ILED3)/(ILED2 + ILED3).
J
=+125°C (typ.).
A-MAX
= T
J-MAX-OP
– (θ
JA
A-MAX
× P
D-MAX
D-MAX
) is dependent on the maximum operating junction temperature (T
JA
), and the junction-to ambient thermal resistance of the part/package in the application (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the
of this product in the micro SMD package could fall in a range as wide as 60°C/W to 110°C/W (if not wider),
).
IN
= 3.6V and T
6
A
= +25°C.
J-MAX-OP
J
=+140°C (typ.) and disengages at
= +125°C), the maximum power
JA
), as given by the