HMPS-282X Hewlett-Packard, HMPS-282X Datasheet

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HMPS-282X

Manufacturer Part Number
HMPS-282X
Description
MiniPak Surface Mount RF Schottky Barrier Diodes
Manufacturer
Hewlett-Packard
Datasheet
Description/Applications
These ultra-miniature products
represent the blending of Agilent
Technologies’ proven semiconduc-
tor and the latest in leadless
packaging. This series of Schottky
diodes is the most consistent and
best all-round device available,
and finds applications in mixing,
detecting, switching, sampling,
clamping and wave shaping at
frequencies up to 6 GHz. The
MiniPak package offers reduced
parasitics when compared to
conventional leaded diodes, and
lower thermal resistance.
Package Lead Code Identification
(Top View)
3
2
Single
#0
4
1
3
2
Anti-parallel
#2
4
1
Agilent HMPS-282x Series
MiniPak Surface Mount
RF Schottky Barrier Diodes
Data Sheet
The HMPS-282x family of diodes
offers the best all-around choice
for most applications, featuring
low series resistance, low forward
voltage at all current levels and
good RF characteristics.
Note that Agilent’s manufacturing
techniques assure that dice found
in pairs and quads are taken from
adjacent sites on the wafer,
assuring the highest degree of
match.
3
2
Parallel
#5
4
1
Features
• Surface mount MiniPak package
• Better thermal conductivity for
• Single and dual versions
• Matched diodes for consistent
• Low turn-on voltage (as low as
• Low FIT (Failure in Time) rate*
• Six-sigma quality level
* For more information, see the Surface
Pin Connections and
Package Marking
Notes:
1. Package marking provides orientation and
2. See “Electrical Specifications” for
Product code
3
2
– low height, 0.7 mm (0.028") max.
– small footprint, 1.75 mm
higher power dissipation
performance
0.34 V at 1 mA)
Mount Schottky Reliability Data Sheet.
identification.
appropriate package marking.
(0.0028 inch
AA
Date code
2
)
4
1
2

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HMPS-282X Summary of contents

Page 1

... Agilent HMPS-282x Series MiniPak Surface Mount RF Schottky Barrier Diodes Data Sheet The HMPS-282x family of diodes offers the best all-around choice for most applications, featuring low series resistance, low forward voltage at all current levels and good RF characteristics. Note that Agilent’s manufacturing ...

Page 2

... HMPS-282x Series Absolute Maximum Ratings Symbol Parameter I Forward Current (1 s pulse Peak Inverse Voltage IV T Junction Temperature j T Storage Temperature stg [2] Thermal Resistance jc Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device +25 C, where T is defined to be the temperature at the package pins where contact is ...

Page 3

... Anti-parallel diode package (HMPx-x8x2 0.05 nH 0 0.05 nH 0 Parallel diode package (HMPx-x8x5 SPICE Parameters Parameter Units HMPS-282x 2.2E 1. ...

Page 4

... HMPS-282x Series Typical Performance (unless otherwise noted), Single Diode c 100 T = +125 + + – 0.1 0.01 0 0.10 0.20 0.30 0.40 0.50 V – FORWARD VOLTAGE (V) F Figure 1. Forward Current vs. Forward Voltage at Temperatures. 1000 100 100 I – FORWARD CURRENT (mA) F Figure 4. Dynamic Resistance vs. Forward Current ...

Page 5

Assembly Information The MiniPak diode is mounted to the PCB or microstrip board using the pad pattern shown in Figure 10. 0.4 0.5 0.4 0.3 0.5 0.3 Figure 10. PCB Pad Layout, MiniPak (dimensions in mm). This mounting pad pattern ...

Page 6

MiniPak Outline Drawing 1.44 (0.058) 1.40 (0.056) 1.20 (0.048) 1.16 (0.046) Top view 0.70 (0.028) 0.58 (0.023) Side view 0.92 (0.037) 0.00 0.88 (0.035) -0.07 (-0.003) 0.42 (0.017) 1.32 (0.053) -0.03 (-0.001) 0.38 (0.015) 1.28 ...

Page 7

Device Orientation REEL USER FEED DIRECTION COVER TAPE Tape Dimensions and Product Orientation For Outline 4T (MiniPak 1412 DESCRIPTION CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER PERFORATION DIAMETER PITCH POSITION CARRIER TAPE WIDTH THICKNESS COVER ...

Page 8

Data subject to change. Copyright © 2001 Agilent Technologies, Inc. January 22, 2001 5988-1551EN ...

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