CLA200 Zarlink Semiconductor, CLA200 Datasheet - Page 10

• Manufacturer Part Number: CLA200
• Description: CMOS Gate Arrays
• Manufacturer: Zarlink Semiconductor

CLA200 Series
PACKAGING
The CLA200 Series is available in a wide range of metric quad
flat packages (MQFP) and plastic ball grid array packages
(BGA) . The currently supported Die size and Package
combinations are shaded. The package style and pin count
information is intended only as a guide. Detailed package
specifications are available from Zarlink Semiconductor
10
C
P
M
M
M
M
M
M
M
M
M
M
F
F
F
F
F
F
T
B
B
B
B
B
A
L
A
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
Q
P
y
G
G
G
G
G
A
C
p
T
F
F
F
F
F
F
F
R
F
F
F
F
F
F
F
F
F
A
A
A
A
A
2
K
e
R
O
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
E
0
A
X I
F
R
0
G
E
M
F
E
R
A
A
P
R
1
1
1
1
1
1
1
1
1
2
1
2
2
3
3
T
M
4
6
6
8
8
n i
0
0
2
2
4
4
6
6
7
0
6
2
5
1
5
E
S
4
4
4
0
0
L I
0
0
0
8
4
4
0
0
6
8
9
5
6
3
2
s
D
Y
1
B
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
3
3
0
0
0
4
4
4
4
8
8
0
8
4
8
4
8
3
7
7
5
5
o
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
d
1
1
1
1
2
1
2
2
2
2
2
2
2
2
2
2
2
2
3
3
y
0
0
0
4
0
4
0
8
8
0
8
4
8
4
8
3
7
7
5
5
N
A
x
S
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
R
o
2 .
2
1
1
2
1
2
3
3
1
3
1
3
1
3
1
1
1
1
1
z i
0 .
4 .
4 .
8 .
4 .
8 .
4 .
4 .
4 .
4 .
4 .
4 .
4 .
4 .
7 .
7 .
7 .
7 .
7 .
R
/ I
0 .
e
A
O
Y
S
P
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
c t i
8 .
5 .
8 .
6 .
8 .
5 .
6 .
8 .
8 .
5 .
6 .
5 .
6 .
5 .
5 .
5 .
5 .
2 .
2 .
2 .
0
0
0
5
0
0
5
0
0
0
5
0
5
0
0
0
0
7
7
7
h
2
4
Advance Information
0
8
1
2
6
0
4
2
2
8
0
0
3
2
1
0
0
4
0
2
1
0
2
5
8
Design Centres on request. Additional packages are being
regularly added to this list, so if a particular package is not
listed, please enquire through your Zarlink Semiconductor
sales representative. A stock is held of the preferred packages
to ensure a fast prototype assembly turn around. Alternative
array size to package combinations are available, but not
always stocked.
2
1
0
4
6
4
2
1
0
6
7
0
2
1
0
7
8
6
2
2
0
0
9
8
2
2
1
4
0
0
2
2
1
7
1
2
2
3
1
0
2
4
2
3
1
2
3
8
2
3
1
5
4
2