CLA70000 Zarlink Semiconductor, CLA70000 Datasheet - Page 14

• Manufacturer Part Number: CLA70000
• Description: High Density CMOS Gate Arrays
• Manufacturer: Zarlink Semiconductor

CLA70000 Series
•
•
•
Production quantities of the CLA70000 family are available in industry-standard ceramic and plastic packages according the
codes shown below. Prototype samples are normally supplied in ceramic only.
DC
DG
DP
AC
AC (P)
MP
LC
HC
GC
GC (P)
HG
GG
HP
GP
Packaging Options
The package style and pin count information is intended only as a guide. Detailed package specification are available from Zarlink
Semiconductor Design Centers on request. Available packages are being continuously updated, so if a particular package is
not listed, please enquire through your Zarlink Semiconductor Sales Representative.
14
KEY
GP44
GP52
GP64
GP80
GP100
GP120
GP144
GP160
Wide range of surface mount and through board packages
Ceramic equivalents to most plastic packages - for fast prototyping
Ongoing commitment to new package development
70
1734
PLASTIC QUAD FLAT PACK (GP)
-
DILMON
CERDIP
PLASDIP
P.G.A.
POWER P.G.A.
SMALL OUTLINE (S.O.)
LCC
LEADED CHIP CARRIER
LEADED CHIP CARRIER
POWER LEADED CHIP CARRIER
QUAD CERPAC
CERAMIC QUAD FLATPACK
PLCC
PQFP
71
1734
1751
1756
1733
AVAILABLE ARRAY /
PACKAGE COMBINATIONS.
72
1710
1756
1733
1644
73
1755
1643
1644
1730
CLA70000 Array Package Guide
74
1643
1644
1730
75
1729
1758
1715
76
1715
77
Dual in Line, Multilayer ceramic. Brazed leads Metal Sealed Lid. Through Board
Dual In Line, Ceramic body, Alloy leadframe, Glass Sealed, Through Board
Dual In Line, Copper or Alloy leadframe, Plastic Moulded. Through Board
Pin Grid Array, Multilayer Ceramic. Metal Sealed lid. Through Board
As above with cavity down and Cu/W heat plate
Dual In Line, ’Gullwing’ Formed Leads. Plastic Moulded Surface Mount
Leadless Chip Carrier. Multilayer Ceramic. Metal Sealed Lid. Surface Mount
Quad Multilayer Ceramic. Brazed J Formed Leads. Metal Sealed Lid.
Surface Mount
Quad Multilayer Ceramic. Brazed Leads. Metal Sealed Lid. Surface Mount
As above with cavity down, and Cu/W heat plate
Quad Ceramic Body, ‘J’ Formed Leads. Glass Sealed. Surface Mount.
Quad Ceramic Body, ‘Gullwing’ Formed Leads. Glass Sealed. Surface Mount.
Quad Plastic Leaded Chip Carrier. ‘J’ Formed Leads. Plastic Moulded.
Surface Mount
Plastic Quad Flat Pack. ‘Gullwing’ Formed Leads. Plastic Moulded. Surface Mount
78
GG44
GG52
GG64
GG80
GG100
GG120
GG144
GG160
70
1735
CERAMIC QUAD FLAT PACK (GG)
-
71
1735
1800
1773
1740
PROTOTYPES ONLY
72
1800
1773
1740
1675
73
1773
1740
1675
1736
74
1771
1675
1736
1769*
75
1737
1770
76
1769
77
78