SBT-BGA-7003 Ironwood Electronics, SBT-BGA-7003 Datasheet

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SBT-BGA-7003

Manufacturer Part Number
SBT-BGA-7003
Description
Socket For Burn-In and Test Applications; Max Pincount: 196; Top Pitch (mm): 0.5; IC Array X: 14; IC Array Y: 14; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.1; IC Siz
Manufacturer
Ironwood Electronics
Datasheet
1.SBT-BGA-7003.pdf (4 pages)
Description: SBT-BGA 8x8mm, 0.5mm pitch, 14x14 array
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
11
4
6
5
1
2
3
7
8
SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
www.ironwoodelectronics.com
Ironwood Electronics, Inc.
Tele: (800) 404-0204
SBT-BGA-7003 Drawing
BURN-IN AND TEST APPLICATIONS
WEIGHT: 12.50
MATERIAL:
FINISH:
16
13
10
3
9
5
ITEM
STATUS: Released
DRAWN BY: Vinayak R
File: SBT-BGA-7003
NO.
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
Features
•
•
•
•
•
•
Target PCB
NUMBER
BGA196A
P-P149A
P8369A
P8370A
P5196A
P8371A
M2423
R1693
M1489
M1144
M1146
M1145
R2613
R1486
R1391
PART
Wide temperature range (-55C to +180C)
High current capability (up to 8A)
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable
production yield
Highly compliant to accommodate wide co-planarity
variations
Automated probe manufacturing enables low cost
and short lead time
Socket Base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
Compression Screw: Clear Anodized Aluminium
Pin Guide screw:Flat head, alloy steel, 0-80 fine
Compression Plate :Black Anodized Aluminium
Socket Shoulder screw: SS- #0-80 threads
Backing Plate: Black Anodizes Aluminium
Socket Base: Black Anodized Aluminium
Socket Lid: Black Anodized Aluminium
Floating Guide: Ceremic Filled Peek
Bottom Guide: Ceremic Filled Peek
Middle Guide: Ceremic Filled Peek
Customer's BGA device
Customers Target PCB
Insulation Plate: FR4
SBT-BGA 0.5mm pin
thread , 6.3mm long.
Alignment Pins
Descripition
SHEET 1 OF 4
SCALE: 2:1
DATE: 5/21/2009
REV. A
QTY.
196
1
1
1
1
4
1
1
1
1
1
1
1
2
4
4

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SBT-BGA-7000
Part Number:
SBT-BGA-7000
Description:
Socket For Burn-In and Test Applications; Max Pincount: 484; Top Pitch (mm): 0.5; IC Array X: 22; IC Array Y: 22; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.5; IC Siz
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Part Number:
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Description:
Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
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Datasheet:
SBT-BGA-6002.pdf (4 pages)
SBT-BGA-7000
Part Number:
SBT-BGA-7000
Description:
Socket For Burn-In and Test Applications; Max Pincount: 484; Top Pitch (mm): 0.5; IC Array X: 22; IC Array Y: 22; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: Included; IC Total Height Max (mm): 1.5; IC Siz
Manufacturer:
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Datasheet:
SBT-BGA-7000.pdf (4 pages)
SBT-BGA-6002
Part Number:
SBT-BGA-6002
Description:
Socket For Burn-In and Test Applications; Max Pincount: 676; Top Pitch (mm): 1; IC Array X: 26; IC Array Y: 26; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 2.5; IC Size
Manufacturer:
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Datasheet:
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SBT-BGA-7003 Summary of contents

Page 1

... R1693 Socket Base screw: Socket head cap, alloy steel with 15 R1486 black oxide finish, 0-80 fine thread , 12.7mm long. Pin Guide screw:Flat head, alloy steel, 0-80 fine 16 R1391 thread , 6.3mm long. STATUS: Released DRAWN BY: Vinayak R File: SBT-BGA-7003 Descripition QTY ...

Page 2

... Description:SBT-BGA-7003 Recommended Layout 8x8mm, 0.5mm pitch, 14x14 array Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ± ...

Page 3

... DETAIL A 0.08 Z SCALE STATUS: DRAWN BY: Vinayak R File: SBT-BGA-7003 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. ...

Page 4

... Materials and specifications are subject to change without notice. SBT-BGA-7003 Drawing Ironwood Electronics, Inc. WEIGHT: 12.50 Tele: (800) 404-0204 MATERIAL: www.ironwoodelectronics.com FINISH: 17.7250 12.7250 10.8200 R0.8000 1.2700 (x4 Insulation Plate Specification STATUS: Released DRAWN BY: Vinayak R File: SBT-BGA-7003 1.7100 (x4) 1.5875 SHEET REV. A SCALE: 2:1 DATE: 5/21/2009 ...

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