FMA246 Filtronic Compound Semiconductors, FMA246 Datasheet - Page 5

• Manufacturer Part Number: FMA246
• Description: HIGH GAIN X-BAND MMIC AMPLIFIER
• Manufacturer: Filtronic Compound Semiconductors

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P
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of conductive epoxy. Epoxy should be applied
to the attachment surface uniformly and
sparingly to avoid encroachment of epoxy on
to the top face of the die and ideally should not
exceed half the chip height. For automated
dispense Ablestick LMISR4 is recommended
and for manual dispense Ablestick 84-1 LMI or
84-1 LMIT are recommended. These should
be cured at a temperature of 150°C for 1 hour
in an oven especially set aside for epoxy
curing only. If possible the curing oven should
be flushed with dry nitrogen.
attach the maximum time at 280-300°C is 60
seconds, and should be kept to a minimum.
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4μm diameter gold wire
be used. Recommended lead bond technique
is thermocompression wedge bonding with
0.001” (25µm) diameter wire. The bond tool
force shall be 35-38 gram.
temperature shall be 230-240°C, heated tool
(150-160°C) is recommended.
thermosonic bonding is not recommended.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
REFERRED
Tel: [phone]
A
SSEMBLY
I
NSTRUCTIONS
Fax: [phone]
Preliminary specifications subject to change without notice
For eutectic die
Bonding stage
Filtronic Compound Semiconductors Ltd
Ultrasonic or
:
5
Email: [e-mail]
H
P
To avoid damage to the devices care should
be
Electrostatic Discharge (ESD) precautions
should be observed at all stages of storage,
handling, assembly, and testing.
devices should be treated as Class 0 (0-250 V)
as defined in JEDEC Standard No. 22-A114.
Further information on ESD control measures
can be found in MIL-STD-1686 and MIL-
HDBK-263.
A
Application Notes and design data including S-
parameters, noise parameters and device
model are available on request.
D
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
O
RECAUTIONS
PPLICATION
ANDLING
ISCLAIMERS
RDERING
P
ART
exercised
FMA246
N
UMBER
I
NFORMATION
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:
OTES
during
Website:
& D
handling.
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D
ESIGN
ESCRIPTION
Preliminary Datasheet v3.0
www.filtronic.com
FMA246
Die
D
ATA
Proper
These
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