DIM400XCM33-F000 Dynex Semiconductor, DIM400XCM33-F000 Datasheet
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DIM400XCM33-F000
Related parts for DIM400XCM33-F000
DIM400XCM33-F000 Summary of contents
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... The DIM400XCM33-F000 is a 3300V, soft punch through n-channel enhancement mode, insulated gate bipolar transistor (IGBT) chopper module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus 10us short circuit withstand ...
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... DIM400XCM33-F000 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under ’Absolute Maximum Ratings’ may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability ...
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... 1MHz 25V 0V 1MHz 125 ° 2500 – di/dt CE(max) CES IEC 6074-9 DIM400XCM33-F000 www.DataSheet4U.com Min Typ. Max 2 = 125 ° case 1 5.5 6.5 7.0 2.8 = 125 ° C 3.6 VJ 400 800 2.9 3.0 72 1.1 30 260 I 2000 1 I 1850 ...
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... DIM400XCM33-F000 ELECTRICAL CHARACTERISTICS T = 25° C unless stated otherwise case Symbol Parameter t Turn-off delay time d(off) t Fall time f E Turn-off energy loss OFF t Turn-on delay time d(on) t Rise time r Q Gate charge g E Turn-on energy loss ON Q Diode reverse recovery charge rr I Diode reverse recovery current ...
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... Fig. 3 Typical output characteristics Fig.5 Typical switching energy vs collector current Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures www.dynexsemi.com www.DataSheet4U.com Fig. 4 Typical output characteristics Fig. 6 Typical switching energy vs gate resistance DIM400XCM33-F000 ...
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... DIM400XCM33-F000 Fig. 7 Diode typical forward characteristics Fig. 9 Diode reverse bias safe operating area 6/8 : This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.DataSheet4U.com Fig. 8 Reverse bias safe operating area Fig. 10 Transient thermal impedance www.dynexsemi.com ...
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... For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures www.dynexsemi.com Nominal weight: 1100g Module outline type code: X Fig.11 Package details DIM400XCM33-F000 www.DataSheet4U.com ...
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... DIM400XCM33-F000 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. ...