DIM800NSM33-F000 Dynex Semiconductor, DIM800NSM33-F000 Datasheet
DIM800NSM33-F000
Related parts for DIM800NSM33-F000
DIM800NSM33-F000 Summary of contents
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... The DIM800NSM33-F000 is a single switch 3300V, soft punch through n-channel enhancement mode, insulated gate bipolar transistor (IGBT) module. The IGBT has a wide reverse bias safe operating area (RBSOA) plus 10us short circuit withstand ...
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... DIM800NSM33-F000 ABSOLUTE MAXIMUM RATINGS Stresses above those listed under ’Absolute Maximum Ratings’ may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability ...
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... V = 25V 0V 1MHz 25V 0V 1MHz 125° 2500V – di/dt CE(max) CES IEC 6074-9 DIM800NSM33-F000 www.DataSheet4U.com Min Typ. Max 4 =125 ° 5.5 6.5 7.0 2.8 = 125 ° C 3.6 J 800 1600 2.9 3.0 144 2.2 15 135 I 4000 1 I 3700 2 Units ...
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... DIM800NSM33-F000 ELECTRICAL CHARACTERISTICS T = 25° C unless stated otherwise case Symbol Parameter t Turn-off delay time d(off) t Fall time f E Turn-off energy loss OFF t Turn-on delay time d(on) t Rise time r E Turn-on energy loss ON Q Gate charge g Q Diode reverse recovery charge rr I Diode reverse recovery current ...
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... Fig. 3 Typical output characteristics Fig.5 Typical switching energy vs collector current Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures www.dynexsemi.com www.DataSheet4U.com Fig. 4 Typical output characteristics Fig. 6 Typical switching energy vs gate resistance DIM800NSM33-F000 ...
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... DIM800NSM33-F000 Fig. 7 Diode typical forward characteristics Fig. 9 Diode reverse bias safe operating area 6/8 : This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. www.DataSheet4U.com Fig. 8 Reverse bias safe operating area Fig. 10 Transient thermal impedance www.dynexsemi.com ...
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... For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures www.dynexsemi.com Nominal weight: 1050g Module outline type code: N Fig.11 Package details DIM800NSM33-F000 www.DataSheet4U.com ...
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... DIM800NSM33-F000 POWER ASSEMBLY CAPABILITY The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. ...