MC14027BCPG ON Semiconductor, MC14027BCPG Datasheet - Page 5

• Manufacturer Part Number: MC14027BCPG
• Description: IC FLIP-FLOP JK DUAL CMOS 16DIP
• Manufacturer: ON Semiconductor
• Series: 4000Br
• Type: JK Typer

Specifications of MC14027BCPG

• Function: Set(Preset) and Reset
• Output Type: Differential
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Frequency - Clock: 13MHz
• Delay Time - Propagation: 50ns
• Trigger Type: Positive Edge
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Circuit Type: Low-Power Schottky
• Current, Supply: 120 μA
• Function Type: 2-Channels
• Logic Function: Flip-Flop
• Logic Type: CMOS
• Number Of Circuits: Dual
• Package Type: PDIP-16
• Special Features: J-K
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• Logic Family: 4000
• Technology: CMOS
• Number Of Bits: 2
• Number Of Elements: 2
• Clock-edge Trigger Type: Positive-Edge
• Polarity: Invert/Non-Invert
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Propagation Delay Time: 450ns
• Low Level Output Current: 4.2mA
• High Level Output Current: -4.2mA
• Frequency (max): 6.5MHz
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 18V
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device
• Other names: MC14027BCPGOS

−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
PLASTIC SOIC PACKAGE
8 PL
PLASTIC DIP PACKAGE
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
MC14027B
P SUFFIX
D SUFFIX
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
7
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
A
B
C
D
G
K
M
R
F
J
P
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MILLIMETERS
MAX
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
1.27 BSC
0
_
_
10.00
18.80
MAX
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
10
INCHES
_
_
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_