LTC2209 Linear Technology Corporation, LTC2209 Datasheet - Page 27

• Manufacturer Part Number: LTC2209
• Description: 160Msps ADC
• Manufacturer: Linear Technology Corporation

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PACKAGE DESCRIPTION
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
7.15 ±0.05
9 .00 ± 0.10
(4 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
7.15 ±0.05
0.50 BSC
0.25 ±0.05
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
(4 SIDES)
7.50 REF
PACKAGE OUTLINE
0.70 ±0.05
0.75 ± 0.05
UP Package
8.10 ±0.05 9.50 ±0.05
(4-SIDES)
7.50 REF
0.200 REF
0.00 – 0.05
R = 0.10
TYP
7.15 ± 0.10
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
7.15 ± 0.10
CHAMFER
C = 0.35
PIN 1
0.50 BSC
0.25 ± 0.05
LTC2209
(UP64) QFN 0406 REV C
63
64
27
0.40 ± 0.10
1
2
2209f