LTC2855 Linear Technology, LTC2855 Datasheet - Page 14

• Manufacturer Part Number: LTC2855
• Description: 3.3V 20Mbps RS485/RS422 Transceivers
• Manufacturer: Linear Technology

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LTC2854/LTC2855
PACKAGE DESCRIPTION
14
3.60 ±0.05
2.20 ±0.05
TOP MARK
1.70 ±0.05
(2 SIDES)
(NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
0.25 ± 0.05
4.00 ±0.10
3.30 ±0.05
(2 SIDES)
(2 SIDES)
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.50
BSC
DE/UE Package
0.70 ±0.05
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
PACKAGE OUTLINE
0.00 – 0.05
R = 0.05
1.70 ± 0.05
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
7
6
R = 0.115
3.30 ±0.05
(2 SIDES)
TYP
0.50
BSC
12
1
0.40 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
(UE12/DE12) DFN 0905 REV C
285455fa