SC16C752BIBS Philips Semiconductors, SC16C752BIBS Datasheet - Page 45

• Manufacturer Part Number: SC16C752BIBS
• Description: 5 V/ 3.3 V and 2.5 V dual UART/ 5 Mbit/s (max.)/ with 64-byte FIFOs
• Manufacturer: Philips Semiconductors

Philips Semiconductors
14. Revision history
Table 28:
9397 750 14443
Product data
Rev Date
03
02
01
20041214
20040527
20040326
Revision history
CPCN
-
-
-
Description
Product data (9397 750 14443)
Modifications:
Product data (9397 750 13337)
Product data (9397 750 11981)
[3]
[4]
[5]
[6]
[7]
[8]
[9]
•
There is no modification to the data sheet. However, reader is advised to refer to
AN10333 (Rev. 02) “SC16CXXXB baud rate deviation tolerance” (9397 750 14411)
that was released together with this revision.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
Rev. 03 — 14 December 2004
10 C measured in the atmosphere of the reflow
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
SC16C752B
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