gt3200 SMC Corporation, gt3200 Datasheet

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gt3200

Manufacturer Part Number
gt3200
Description
Usb2.0 Phy Ic
Manufacturer
SMC Corporation
Datasheet

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gt3200-JV
Manufacturer:
SMSC
Quantity:
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PRODUCT FEATURES
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SMSC GT3200, SMSC USB3250
USB-IF "Hi-Speed" certified to USB2.0 electrical
Interface compliant with the UTMI specification
Supports 480Mbps High Speed (HS) and 12Mbps
Integrated 45
Internal short circuit protection of DP and DM lines
On-chip oscillator operates with low cost 12MHz
Robust and low power digital clock and data recovery
SYNC and EOP generation on transmit packets and
specification
(60MHz 8-bit unidirectional interface or 30MHz 16-bit
bidirectional interface)
Full Speed (FS) serial data transmission rates
reduce external component count
crystal
circuit
detection on receive packets
and 1.5k
termination resistors
DATASHEET
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NRZI encoding and decoding
Bit stuffing and unstuffing with error detection
Supports the USB suspend state, HS detection, HS
Support for all test modes defined in the USB2.0
Draws 72mA (185mW) maximum current
On-die decoupling capacitance and isolation for
Available in three 64-pin TQFP packages (GT3200)
Full industrial operating temperature range from
Chirp, Reset and Resume
specification
consumption in HS mode - ideal for bus powered
functions
immunity to digital switching noise
or a 56-pin QFN package (USB3250)
-40
GT3200
USB3250
USB2.0 PHY IC
o
C to +85
(64-PIN TQFP PACKAGES)
(56-PIN QFN PACKAGE)
o
C (ambient)
Revision 1.3 (10-05-04)
Datasheet

Related parts for gt3200

gt3200 Summary of contents

Page 1

... Draws 72mA (185mW) maximum current I consumption in HS mode - ideal for bus powered functions On-die decoupling capacitance and isolation for I immunity to digital switching noise Available in three 64-pin TQFP packages (GT3200 56-pin QFN package (USB3250) Full industrial operating temperature range from ...

Page 2

... GT3200 - JD FOR 64 PIN 1.4MM TQFP PACKAGE GT3200 - JN FOR 64 PIN 1.4MM TQFP PACKAGE GT3200 - JV FOR 64 PIN 1.4MM TQFP LEAD FREE PACKAGE USB3250 - ABZJ FOR 56 PIN 0.85MM QFN LEAD FREE PACKAGE 80 Arkay Drive Hauppauge, NY 11788 ...

Page 3

... Suspend Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 8.7 HS Detection Handshake . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8.8 HS Detection Handshake - FS Downstream Facing Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8.9 HS Detection Handshake - HS Downstream Facing Port 8.10 HS Detection Handshake - Suspend Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 8.11 Assertion of Resume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 8.12 Detection of Resume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8.13 HS Device Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8.14 Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Chapter 9 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 SMSC GT3200, SMSC USB3250 iii DATASHEET Revision 1.3 (10-05-04) ...

Page 4

... Figure 8.9 Application Diagram for 64-pin TQFP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Figure 8.10 Application Diagram for 56-pin QFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 9.1 GT3200-JD 64 Pin TQFP Package Outline, 10x10x1.4mm Body . . . . . . . . . . . . . . . . . . . . . 42 Figure 9.2 GT3200-JN, JV (lead free) 64 Pin TQFP Package Outline, 7x7x1.4mm Body . . . . . . . . . . . 44 Figure 9.3 USB3250-ABZJ (lead free) 56 Pin QFN Package Outline, 8x8x0.85mm Body . . . . . . . . . . 45 Revision 1 ...

Page 5

... Table 8.8 HS Detection Handshake Timing Values from Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 8.9 Resume Timing Values (HS Mode Table 8.10 Attach and Reset Timing Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 9.1 GT3200-JD 64 Pin TQFP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 9.2 GT3200-JN, JV (lead free) 64 Pin TQFP Package Parameters . . . . . . . . . . . . . . . . . . . . . . . 44 Table 9.3 USB3250-ABZJ (lead free) 56 Pin QFN Package Parameters SMSC GT3200, SMSC USB3250 ...

Page 6

... Chapter 1 General Description The GT3200 and USB3250 provide the Physical Layer (PHY) interface to a USB2.0 Device Controller. The IC is available pin lead TQFP (GT3200 pin QFN (USB3250). 1.1 Applications The Universal Serial Bus (USB) is the preferred interface to connect high-speed PC peripherals. ...

Page 7

... Chapter 2 Functional Block Diagram PWR CONTROL DATABUS16_8 RESET SUSPENDN XCVRSELECT TERMSELECT LINESTATE[1:0] CLKOUT TXVALID RXACTIVE Note: See Section 7.1, "Modes of Operation," on page 18 SMSC GT3200, SMSC USB3250 PLL and XTAL OSC TX LOGIC RPU_EN TX State Machine VPO VMO Parallel to OEB Serial Conversion HS_DATA ...

Page 8

... DP 5 VDDA3 VSSA RBIAS 8 VDDA3 VSSA VDDA1 SUSPENDN 15 VSS 16 Revision 1.3 (10-05-04) USB2.0 GT3200 PHY IC Figure 3.1 64 pin GT3200 Pinout 3 DATASHEET USB2.0 PHY IC 48 VSS DATA[1] 47 DATA[ DATA[3] 44 DATA[4] VDD1.8 43 DATA[5] 42 DATA[ DATA[7] 39 DATA[8] 38 VSS DATA[ ...

Page 9

... USB2.0 PHY IC 1 VSSA VDDA3.3 4 VSSA 5 RBIAS 6 VDDA3.3 7 VSSA 8 VSSA VDDA1.8 12 SUSPENDN 13 VSS 14 SMSC GT3200, SMSC USB3250 USB2.0 USB3250 PHY IC Figure 3.2 56 pin USB3250 Pinout 4 DATASHEET 42 DATA[1] 41 DATA[2] 40 DATA[3] 39 DATA[4] 38 VDD1.8 37 DATA[5] 36 DATA[6] 35 DATA[7] 34 DATA[8] 33 VSS 32 DATA[9] 31 DATA[10] ...

Page 10

... SE0 State State SE1 N/A Databus Select. Selects between 8-bit and 16-bit data transfers. 0: 8-bit data path enabled. VALIDH is undefined. CLKOUT = 60MHz. 1: 16-bit data path enabled. CLKOUT = 30MHz. 5 DATASHEET USB2.0 PHY IC DESCRIPTION pull-up on SMSC GT3200, SMSC USB3250 ...

Page 11

... USB2.0 PHY IC NAME DIRECTION DATA[15:0] Bidir TXVALID Input TXREADY Output VALIDH Bidir RXVALID Output RXACTIVE Output RXERROR Output SMSC GT3200, SMSC USB3250 Table 4.2 Data Interface Signals ACTIVE LEVEL N/A DATA BUS. 16-BIT BIDIRECTIONAL MODE. TXVALID RXVALID DATA BUS. 8-BIT UNIDIRECTIONAL MODE. ...

Page 12

... Digital Supply. Powers digital pads. See N/A 1.8V Digital Supply. Powers digital core. N/A Digital Ground. See Note 4.2 N/A 3.3V Analog Supply. Powers analog I/O and 3.3V analog circuitry. N/A 1.8V Analog Supply. Powers 1.8V analog circuitry. See N/A Analog Ground. See Note 4.2 7 DATASHEET USB2.0 PHY IC DESCRIPTION DESCRIPTION resistor to ground. DESCRIPTION Note 4.1 Note 4.1 40. SMSC GT3200, SMSC USB3250 ...

Page 13

... Supply Voltage (VDD3.3 and VDDA3.3) Input Voltage on Digital Pins Input Voltage on Analog I/O Pins (DP, DM) Ambient Temperature Table 5.3 Recommended External Clock Conditions PARAMETER SYMBOL System Clock Frequency System Clock Duty Cycle SMSC GT3200, SMSC USB3250 CONDITIONS V DD1.8 V DD3 STG resistor (HBM). ...

Page 14

... MIN TYP MAX UNITS 86 115 115 158 185 mW 110 130 155 185 mW 107 130 123 240 uA 68 120 uA 55 120 uA 323 460 uA 268 340 uA 55 120 uA SMSC GT3200, SMSC USB3250 ...

Page 15

... Driver Output Impedance for Z HS and FS Input Impedance Pull-up Resistor Impedance Termination Voltage For Pull- up Resistor On Pin DP HS FUNCTIONALITY INPUT LEVELS HS Differential Input Sensitivity (V =1.6 to 2.0V; V =3.0 to 3.6V; V DD1.8 DD3.3 SMSC GT3200, SMSC USB3250 CONDITIONS 4mA -4mA OH OH ...

Page 16

... MIN TYP MAX UNITS -50 500 mV 100 mV 150 mV - 360 440 mV - 700 1100 mV -900 -500 mV ± unless otherwise specified.) MIN TYP MAX UNITS 1.3 2.0 90 111 unless otherwise specified.) SMSC GT3200, SMSC USB3250 ...

Page 17

... OPMODE[1:0] XCVRSELECT TERMSELECT SUSPENDN TXDATA[7:0] TXVALID OPMODE[1:0] XCVRSELECT TERMSELECT SUSPENDN (V =1.6 to 2.0V; V =3.0 to 3.6V; V DD1.8 DD3.3 SMSC GT3200, SMSC USB3250 CONDITIONS T HSR T HSF Eye pattern of Template 1 in USB2.0 specification Eye pattern of Template 4 in USB2.0 specification Eye pattern of Template 4 in USB2.0 specification -40 ...

Page 18

... Ohm). The output voltage must be within 10mV of ground when no current is flowing in or out of the pin. Drive High I out (mA) -6 -10. out Figure 6.1 Full-Speed Driver VOH/IOH Characteristics for High-speed Capable Transceiver Revision 1.3 (10-05-04) Slope = 1/49.5 Ohm Test Limit 0.566*V OH (Volts) 13 DATASHEET USB2.0 PHY IC Slope = 1/40.5 Ohm 0.698 SMSC GT3200, SMSC USB3250 ...

Page 19

... High-speed USB signals are characterized using eye patterns. For measuring the eye patterns 4 points have been defined (see eye patterns in several 'templates'. The two templates that are relevant to the PHY are shown below. SMSC GT3200, SMSC USB3250 Slope = 1/40.5 Ohm Slope = 1/49.5 Ohm 1 ...

Page 20

... Mbit/s transmission rate. Revision 1.3 (10-05-04) TP3 USB B Connector Device Circuit Board defines the transmit waveform requirements for a hub (measured at TP2 Table 6.6. Time is specified as a percentage of the unit interval 15 DATASHEET USB2.0 PHY IC TP4 Traces Transceiver Figure 6.3). The corresponding SMSC GT3200, SMSC USB3250 ...

Page 21

... Figure 6.5 test point TP2 of Figure Figure 6.3). The corresponding signal levels and timings are given in a percentage of the unit interval (UI), which represents the nominal bit duration for a 480 Mbit/s transmission rate. SMSC GT3200, SMSC USB3250 Point 3 Point 4 Point 1 Point 2 Point 5 Point 6 Unit Interval ...

Page 22

... Point 3 150mV Point 4 150mV Point 5 -150mV Point 6 -150mV Revision 1.3 (10-05-04) Point 3 Point 4 Point 1 Point 2 Point 5 Point 6 100% VOLTAGE LEVEL (D+, D-) 17 DATASHEET USB2.0 PHY IC 400mV Differential 0 Volt / Differential -400mV Differential TIME (% OF UNIT INTERVAL) N/A N/A 15% UI 85% UI 35% UI 65% UI 35% UI 65% UI SMSC GT3200, SMSC USB3250 ...

Page 23

... Figure 2.1 Block Diagram on page 2 USB3250. Each of the functions is described in detail below. 7.1 Modes of Operation The GT3200, SMSC USB3250 support two modes of operation. See of the digital interface. 8-bit unidirectional mode. Selected when DATABUS16_8 = 0. CLKOUT runs at 60MHz. The 8- I bit transmit data bus uses the lower 8 bits of the DATA bus (ie, TXDATA[7:0] = DATA[7:0]). The 8-bit receive data bus uses the upper 8 bits of the DATA bus (ie, RXDATA[7:0] = DATA[15:8]) ...

Page 24

... Macrocell is switched between modes mode (8-bit mode) there are 5 CLK60 cycles per FS bit time, typically 40 CLK60 cycles per FS byte time received byte contains a stuffed Revision 1.3 (10-05-04) 1=1 -bit mode, 0=8-bit mode 6 SELB : DATASHEET USB2.0 PHY IC TXVALID DATABUS16_ 8 DATA[7:0] DATA[15:8] VALID H SMSC GT3200, SMSC USB3250 ...

Page 25

... This block consists of the Clock and Data Recovery Circuit and the Elasticity Buffer. The Elasticity Buffer is used to compensate for differences between the transmitting and receiving clock domains. The USB2.0 specification defines a maximum clock error of ±1000ppm of drift. SMSC GT3200, SMSC USB3250 Don't DATA1 ...

Page 26

... DATA DATA PID DATA DATA SYNC PID DATA (1) DATA (3) DATA (0) DATA (2) DATA (4) SYNC PID DATA DATA DATASHEET USB2.0 PHY IC Figure 7.4. CRC CRC DATA DATA CRC CRC EOP CRC (HI) CRC (LO) DATA DATA DATA CRC CRC EOP SMSC GT3200, SMSC USB3250 ...

Page 27

... RXDATA bus. The processing involved includes NRZI decoding, bit unstuffing, and serial to parallel conversion. Upon valid assertion of the proper RX control lines by the RX State Machine, the RX Logic block will provide bytes to the RXDATA bus as shown in the figures below. The behavior of the Receive State Machine is described below. SMSC GT3200, SMSC USB3250 PID DATA (1) DATA (3) ...

Page 28

... Figure 7.8 Receive Timing for 16-bit Data, Even Byte Count Revision 1.3 (10-05-04) Invalid Data DATA DATA DATA DATA Invalid PID DATA (1) DATA (0) DATA (2) DATA DATA DATA DATA DATA CRC DATASHEET USB2.0 PHY IC Data CRC CRC DATA (3) CRC (LO) DATA (4) CRC (HI) CRC EOP HI SMSC GT3200, SMSC USB3250 ...

Page 29

... Figure 7.10 shows the timing relationship between the received data (DP/DM) , RXVALID, I RXACTIVE, RXERROR and RXDATA signals. Note 7.1 The USB2.0 Transceiver does NOT decode Packet ID's (PIDs). They are passed to the SIE for decoding. SMSC GT3200, SMSC USB3250 PID DATA (1) DATA (0) DATA (2) A DATA ...

Page 30

... Figure 7.11 Receive Timing for Setup Packet (8-bit mode) Revision 1.3 (10-05-04) Figure 7.11 and Figure 7.12 are timing examples of a HS/FS Macrocell when Figure 7.11 and Figure 7.12 the SYNC pattern on DP/DM is shown as one PID SYNC PID EOP PID DATA DATA PID DATA DATA EOP CRC-5 Computation 25 DATASHEET USB2.0 PHY IC SMSC GT3200, SMSC USB3250 ...

Page 31

... This block requires an external precision resistor (12k the RBIAS pin to analog ground). 7.9 Power Control This is the block that receives and distributes all the power for the transceiver. This block is also responsible for handling ESD protection. SMSC GT3200, SMSC USB3250 PID DATA DATA DATA PID ...

Page 32

... The HS receiver is used to detect Chirp where the output of the HS receiver is always qualified with the Squelch signal. If squelched, the output of the HS receiver is ignored. In the GT3200, SMSC USB3250 alternative to using variable thresholds for the single-ended receivers, the following approach is used. ...

Page 33

... Disable Bit Disables bitstuffing and NRZI encoding logic so that 1's loaded from the TXDATA bus become 'J's on the DP/DM Stuffing and NRZI and 0's become 'K's encoding Reserved N/A GT3200, SMSC USB3250 SETUP SIE TRANSMITTED DATA Normal No transmit Disable All '1's Disable All '0's Normal ...

Page 34

... FS pull-up on the DP line in an attempt to assert a continuous FS J state on the bus. The Revision 1.3 (10-05-04) T1 Driven SE0 DESCRIPTION 29 DATASHEET USB2.0 PHY Detection Handshake VALUE 0 (reference) HS Reset 0ms < T1 < HS Reset T0 + 3.125ms T1 + 100µs < T2 < 875µs SMSC GT3200, SMSC USB3250 ...

Page 35

... Detection Handshake. Depending on the initial state, an SE0 condition can be asserted from before initiating the HS Detection Handshake. These states are described in the USB2.0 specification. There are three ways in which a device may enter the HS Handshake Detection process: SMSC GT3200, SMSC USB3250 ...

Page 36

... If the downstream facing port is not HS capable, then the HS K asserted by the device is ignored and the alternating sequence of HS Chirp K's and J's is not generated chirps are detected (T4) by the device, it will enter FS mode by returning XCVRSELECT to FS mode. Revision 1.3 (10-05-04) 31 DATASHEET USB2.0 PHY IC SMSC GT3200, SMSC USB3250 ...

Page 37

... FS default state and waits for end of reset. T5 Earliest time at which host port may end reset Note 8.1 T0 may occur to 4ms after HS Reset T0. Note 8.2 The SIE must assert the Chirp K for 66000 CLK60 cycles to ensure a 1ms minimum duration. SMSC GT3200, SMSC USB3250 SE0 No Downstream ...

Page 38

... SIE sampling the LINESTATE signals. Revision 1.3 (10-05-04) !K State K State Detect K? Chirp Count Chirp Count != 6 & !SE0 !J J State Detect J? Chirp Chirp Count != 6 & !SE0 33 DATASHEET USB2.0 PHY IC Chirp INC Invalid SE0 Chirp Count = INC Chirp Valid SMSC GT3200, SMSC USB3250 ...

Page 39

... T6 Device detects downstream port chirp. T7 Chirp detected by the device. Device removes DP pull-up and asserts HS terminations, reverts to HS default state and waits for end of reset. T8 Terminate host port Chirp K-J sequence (Repeating T4 and T5) SMSC GT3200, SMSC USB3250 Device ...

Page 40

... Chirp K is completed (T3) the SIE can begin looking for host chirps and use CLK60 to time the process. At this time, the device follows the same protocol as in section 8.9 for completion of the High Speed Handshake. Revision 1.3 (10-05-04) DESCRIPTION Figure 8.6 shows how CLK60 is used to control the duration of the 35 DATASHEET USB2.0 PHY IC VALUE HS Reset T0 + 10ms SMSC GT3200, SMSC USB3250 ...

Page 41

... Device asserts Chirp K on the bus. T3 Device removes Chirp K from the bus minimum width) and begins looking for host chirps. T4 CLK "Nominal" (CLKOUT is frequency accurate to ±500 ppm, duty cycle accurate to 50±5). SMSC GT3200, SMSC USB3250 T1 T2 SE0 CLK power up time Device Chirp K DESCRIPTION ...

Page 42

... Latest time at which a device, which was previously in HS mode, must restore HS mode after bus activity stops. Revision 1.3 (10-05-04 'K' State FS Mode DESCRIPTION 37 DATASHEET USB2.0 PHY SE0 HS Mode VALUE 0 (reference) T0 < T1 < 10ms 1.0ms < T2 < 15ms T1 + 20ms T3 + 1.33µs {2 Low-speed bit times} SMSC GT3200, SMSC USB3250 ...

Page 43

... The SIE must then check the LINESTATE signals for SE0. If LINESTATE = SE0 is asserted at time T2 then the upstream port is forcing the reset state to the device (i.e. Driven SE0). The device will then reset itself before initiating the HS Detection Handshake protocol. SMSC GT3200, SMSC USB3250 Figure 8.8 38 ...

Page 44

... Maximum time from Vbus valid to when the device must signal attach. T2 (HS Reset T0) Debounce interval. The device now enters the HS Detection Handshake protocol. Revision 1.3 (10-05-04) T1 Idle (FS 'J') Figure 8.8 Device Attach Behavior DESCRIPTION 39 DATASHEET USB2.0 PHY IC T2 SE0 HS Detection Handshake VALUE 0 (reference 100ms < 100ms < T2 SMSC GT3200, SMSC USB3250 ...

Page 45

... VDD3.3 VDD1.8 Voltage Regulator 1uF 1uF 10uF 10uF C LOAD 12MHz Crystal C LOAD Ferrite Bead 10uF Ferrite Bead Figure 8.9 Application Diagram for 64-pin TQFP Package SMSC GT3200, SMSC USB3250 UTMI TXREADY 50 DATA 0 RXACTIVE 47 DATA 1 RXVALID 46 DATA 2 RXERROR 45 DATA 3 44 DATA 4 DATABUS16_8 42 DATA 5 ...

Page 46

... VDD1.8 53 VDD1.8 VDD1.8 4 VDDA3.3 7 VDDA3.3 15 VDD3.3 28 VDD3.3 43 VDD3.3 VDD3.3 41 DATASHEET USB2.0 PHY VALIDH RESET RBIAS 12K 3 DP USB VSSA 5 VSSA 8 VSSA 9 VSSA 14 VSS 33 VSS 48 VSS 55 VSS 56 VSS GND SMSC GT3200, SMSC USB3250 ...

Page 47

... USB2.0 PHY IC Chapter 9 Package Outlines The PHY is offered in four package types: GT3200-JD (10x10x1.4mm TQFP), GT3200-JN (7x7x1.4mm TQFP), GT3200-JV (7x7x1.4mm TQFP lead free), GT3200-ABZJ (8x8x0.85mm QFN lead free) Figure 9.1 GT3200-JD 64 Pin TQFP Package Outline, 10x10x1.4mm Body Table 9.1 GT3200-JD 64 Pin TQFP Package Parameters MIN ...

Page 48

... Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm per side. 4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane. 5 Details of pin 1 identifier are optional but must be located within the zone indicated. Revision 1.3 (10-05-04) 43 DATASHEET USB2.0 PHY IC SMSC GT3200, SMSC USB3250 ...

Page 49

... USB2.0 PHY IC Figure 9.2 GT3200-JN, JV (lead free) 64 Pin TQFP Package Outline, 7x7x1.4mm Body Table 9.2 GT3200-JN, JV (lead free) 64 Pin TQFP Package Parameters MIN 0.05 A2 1.35 D 8.80 D1 6.80 E 8.80 E1 6.80 H 0. 0.13 ccc ~ Notes: 1 Controlling Unit: millimeter. 2 Tolerance on the true position of the leads is ± 0.035 mm maximum. ...

Page 50

... MIN A 0. 7.85 D1 7.55 D2 2.25 E 7.85 E1 7.55 E2 2.25 L 0.30 Revision 1.3 (10-05-04) NOMINAL MAX ~ 1.00 Overall Package Height 0.02 0.05 Standoff ~ 0.80 Mold Thickness 8.00 8.15 X Overall Size ~ 7.95 X Mold Cap Size ~ 6.80 X exposed Pad Size 8.00 8.15 Y Overall Size ~ 7.95 Y Mold Cap Size ~ 6.80 Y exposed Pad Size ~ 0.50 Terminal Length 45 DATASHEET USB2.0 PHY IC REMARKS SMSC GT3200, SMSC USB3250 ...

Page 51

... Tolerance on the true position of the terminal is ± 0. maximum material conditions (MMC). 3 Details of terminal #1 identifier are optional but must be located within the zone indicated. 4 Coplanarity zone applies to exposed pad and terminals. SMSC GT3200, SMSC USB3250 NOMINAL MAX 0.50 Basic Terminal Pitch ~ ...

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