74ALVC374PW,112 NXP Semiconductors, 74ALVC374PW,112 Datasheet
74ALVC374PW,112
Specifications of 74ALVC374PW,112
74ALVC374PW
935269732112
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74ALVC374PW,112 Summary of contents
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Octal D-type flip-flop; positive-edge trigger; 3-state Rev. 02 — 17 October 2007 1. General description The 74ALVC374 is an octal D-type flip-flop featuring separate D-type inputs for each flip-flop and 3-state outputs for bus-oriented applications. A clock input (CP) ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74ALVC374D +85 C 74ALVC374PW +85 C 74ALVC374BQ + Functional diagram Fig 1. Logic symbol 74ALVC374_2 Product data sheet Octal D-type flip-flop; positive-edge trigger; 3-state Description SO20 plastic small outline package; 20 leads; ...
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... NXP Semiconductors Fig 3. Functional diagram FF1 FF2 Fig 4. Logic diagram 74ALVC374_2 Product data sheet Octal D-type flip-flop; positive-edge trigger; 3-state FF1 D3 3-STATE OUTPUTS FF8 FF3 FF4 Rev. 02 — 17 October 2007 74ALVC374 mna892 FF5 FF6 FF7 Q4 Q5 © NXP B.V. 2007. All rights reserved. ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 374 GND 001aad040 Fig 5. Pin configuration SO20 and TSSOP20 5.2 Pin description Table 2. Pin description Symbol Pin D[0: 13, 14, 17 Q[0: 12, 15, 16 GND 10 74ALVC374_2 Product data sheet Octal D-type flip-flop; positive-edge trigger; 3-state (1) The die substrate is attached to this pad using conductive die attach material ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Operating mode Input OE Load and read register L L Load register and disable H outputs H [ HIGH voltage level h = HIGH voltage level one set-up time prior to the LOW to HIGH CP transition L = LOW voltage level l = LOW voltage level one set-up time prior to the LOW to HIGH CP transition ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter I OFF-state output current OZ I power-off leakage supply OFF I supply current CC I additional supply current CC C input capacitance I [1] All typical values are measured at V 10. Dynamic characteristics Table 7 ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t set-up time su t hold time h f maximum frequency max C power dissipation PD capacitance [1] Typical values are measured the same as t and PHL PLH t is the same as t and t ...
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... NXP Semiconductors 11. Waveforms CP input Qn output Measurement points are given in V and V are the typical output voltage levels that occur with the output load Fig 7. Clock (CP) to output (Qn) propagation delays, the clock pulse width and the maximum frequency Table 8. Measurement points Supply voltage ...
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... NXP Semiconductors CP input Dn input Qn output Measurement points are given in V and V are the typical output voltage drops that occur with the output load The shaded areas indicate when the input is permitted to change for predicable output performance. Fig 9. Data set-up and hold times for the Dn input to the CP input ...
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... NXP Semiconductors Test data is given in Table 9. Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 10. Test circuitry for switching times Table 9. Test data ...
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... NXP Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 2.65 mm 0.25 0.1 2.25 0.012 0.096 0.1 inches 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Document ID Release date 74ALVC374_2 20071017 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Revision history ...