sl13-n FORMOSA MICROSEMI CO. LTD, sl13-n Datasheet

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sl13-n

Manufacturer Part Number
sl13-n
Description
Low Vf Chip Schottky Barrier Rectifier
Manufacturer
FORMOSA MICROSEMI CO. LTD
Datasheet
Low VF Chip Schottky Barrier Rectifier
SL12-N THRU SL14-N
List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Page 1
Document ID
DS-121652
Formosa MS
Issued Date
2008/02/10
Revised Date
-
Revision
A
Page.
7
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sl13-n Summary of contents

Page 1

Low VF Chip Schottky Barrier Rectifier SL12-N THRU SL14-N List List................................................................................................. Package outline............................................................................... Features.......................................................................................... Mechanical data............................................................................... Maximum ratings ............................................................................. Rating and characteristic curves........................................................ Pinning information........................................................................... Marking........................................................................................... Suggested solder pad layout............................................................. Packing information.......................................................................... Reel packing.................................................................................... Suggested thermal profiles for soldering processes............................. ...

Page 2

... Thermal resistance Junction to ambient Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature * SYMBOLS RMS RRM (V) (V) SL12 SL13 SL14 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Package outline 0.016(0.4) Typ. o CONDITIONS RRM ...

Page 3

Rating and characteristic curves (SL12-N THRU SL14-N) FIG.1-TYPICAL FORWARD CHARACTERISTICS 50 10 3.0 1 Pulse Width 300us 1% Duty Cycle 0.1 . 1.1 1.3 FORWARD VOLT AGE,(V) FIG.3 - TYPICAL REVERSE ...

Page 4

... Low VF Chip Schottky Barrier Rectifier SL12-N THRU SL14-N Pinning information Pin Pin1 cathode Pin2 anode Marking Type number SL12-N SL13-N SL14-N Suggested solder pad layout PACKAGE SOD-323 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Simplified outline 1 Marking code Dimensions in inches and (millimeters) ...

Page 5

Low VF Chip Schottky Barrier Rectifier SL12-N THRU SL14-N Packing information Item Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner ...

Page 6

Low VF Chip Schottky Barrier Rectifier SL12-N THRU SL14-N Reel packing COMPONENT PACKAGE REEL SIZE REEL SPACING (pcs) 7" 3000 SOD-323 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=10 C~35 C Humidity=65%±15% 2.Reflow soldering of surface-mount devices T P ...

Page 7

Low VF Chip Schottky Barrier Rectifier SL12-N THRU SL14-N High reliability test capabilities Item Test 1. Solder Resistance 2. Solderability 3. High Temperature Reverse Bias 4. Forward Operation Life 5. Intermittent Operation Life 6. Pressure Cooker 7. Temperature Cycling 8. ...

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