t1670p Vishay, t1670p Datasheet - Page 3

• Manufacturer Part Number: t1670p
• Description: Silicon Pin Photodiode
• Manufacturer: Vishay

Note
(1)
HANDLING AND STORAGE CONDITIONS
• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only. It
• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as defined
• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.
PACKING
Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the wafers
are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence (humidity and
contamination).
Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take
back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for
packing material that is returned unsorted or which we are not obliged to accept.
Document Number: 81999
Rev. 1.0, 19-May-09
ADDITIONAL INFORMATION
Frontside metallization, anode
Backside metallization, cathode
Dicing
Die bonding technology
is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
in MIL-HDBK-263.
All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.
The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip
backside is performed with stereo microscope with incident light and 40x to 80x magnification.
The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure
by QM is not installed.
For technical questions, contact:
(1)
Silicon PIN Photodiode
[e-mail]
Epoxy bonding
Vishay Semiconductors
NiV-Ag
Sawing
AlSi
www.vishay.com
T1670P
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