bsv-1.5s12r0h XP Power Limited, bsv-1.5s12r0h Datasheet - Page 51

• Manufacturer Part Number: bsv-1.5s12r0h
• Description: Pol Dc-dc Converter
• Manufacturer: XP Power Limited

11. Mounting conditions
12. Vibration and shock test
11-1. Re-flow method
The conditions stated below are required to follow such as soldering temp, time and storage before
mounting. The converter can not be mounted by flow soldering.
11-2. Storage before mounting
Vibration
Shock
Pre-heat temp:
Peak temp:
Number of re-flows: twice
Note1) Make sure not to vibrate during the re-flow or components making up the converter may be
Note2) After mounting the converter to PCB, re-flow can not be repeated with the PCB upside down.
This is MSL 3 product. Storage conditions before mounting should be at 30°C/60% RH or below
after opening the dry pack. Furthermore, baking (125°C ±5°C, 12H) is required before the re-flow
when exceeding one year period in a dry pack condition and 168 hours at 30°C/60% RH in an open
dry pack condition.
After mounting, it depends on the storing condition.
DC-DC Converter
T
e
m
p
dislocated.
2.3℃/sec max
Small Type High-Speed Response POL DC-DC Converter
5-10Hz All amplitudes 10mm, 10-55Hz Acceleration 2G (3 direction for 1H each)
Acceleration 20G (3 direction, 3 times each)
Shock time
Temp regulation point is
the component surface temp
150 - 180°C, 60sec max. (Refer to the below chart)
250°C max.
220°C or above, 60sec max.
180℃
150℃
11±5ms
60sec max
2℃/sec max
60sec max
Peak:250℃ max
220℃
1-4℃/sec
BSV-nano Series
Time
BDD20100416
12