cs8183 ON Semiconductor, cs8183 Datasheet
cs8183
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cs8183 Summary of contents
Page 1
... Dual Micropower 200 mA Low Dropout Tracking Regulator/Line Driver The CS8183 is a dual low dropout tracking regulator designed to provide adjustable buffered output voltages that closely track (±10 mV) the reference inputs. The outputs deliver up to 200 mA while being able to be configured higher, lower or equal to the reference voltages ...
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... Shutdown PACKAGE PIN DESCRIPTION Package Lead # SO−20W Lead Symbol 13, 14 CS8183 Current Limit & VSAT Sense − ENABLE + + − Current Limit & VSAT Sense − ENABLE + + − Figure 1. Block Diagram V Input voltage for V ...
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... Ripple Rejection Thermal Shutdown V /ENABLE 1, 2 REF Enable Voltage Input Bias Current connected to Adj lead. OUT CS8183 Rating ) Reflow: (SMD styles only) (Note 1) /ENABLE > 2.75 V; −40°C ≤ REF Test Conditions ≤ 100 mA ≤ I ≤ 200 mA, (Note 3) ...
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... V** ref FORCED V VOLTAGE (V) out Figure 5. V Reverse Current out CS8183 TYPICAL CHARACTERISTICS 100 120 140 160 180 200 OUTPUT CURRENT (mA) 100 Figure 4. Quiescent Current vs. Input Voltage ...
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... Figure 11. Alternative ENABLE Circuit * C1 is required if the regulator is far from the power source filter ** C2 is required for stability *** C3 is recommended for EMC susceptibility CS8183 CIRCUIT DESCRIPTION The outputs are capable of supplying 200 mA to the load while configured as a similiar (Figure 7), lower (Figure 9), or higher (Figure 8) voltage as the reference lead ...
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... V REF ADJ2 ENABLE1 V REF Figure 13. 400 mA Loading Switched Application The CS8183 has been designed for use in systems where the reference voltage on the V REF continuously on. Typically, the current into the /ENABLE pin will be less than 1.0 mA when the V REF voltage on the V pin (usually the ignition line) has been ...
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... Features I Q Figure 15. Dual Output Regulator with Key Performance Parameters Labeled CS8183 Heatsinks A heatsink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance ...
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... DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0. Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CS8183/D ...