c505rt230-s0200 Cree, Inc., c505rt230-s0200 Datasheet

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c505rt230-s0200

Manufacturer Part Number
c505rt230-s0200
Description
Razerthin Leds
Manufacturer
Cree, Inc.
Datasheet
RazerThin
CxxxRT230-S0200
Cree’s RazerThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver
superior price/performance for blue and green LEDs. These vertically structured LED chips are small in size and
require a low forward voltage. Cree’s RT series chips are tested for conformity to optical and electrical specifications
and the ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and
thinner form factors are required.
FEATURES
CxxxRT230-S0200 Chip Diagram
Top View
Small Chip - 200 x 200 x 85 μm
Low Forward Voltage
RT230™ LED Performance
Single Wire Bond Structure
Class 2 ESD Rating
3.1 V Typical at 20 mA - Blue & Traffic Green
3.2 V Typical at 20 mA Green
2.0 mW min. Blue
1.5 mW min. Green
®
G•SiC® LED Chip
200 x 200 μm
Mesa (junction)
176 x 176 μm
Gold Bond Pad
105 μm Diameter
LEDs
Subject to change without notice.
www.cree.com
Bottom View
APPLICATIONS
Mobile Phone Key Pads
Audio Product Display Lighting
Mobile Appliance Keypads
Automobile Dashboard Lighting
Blue LEDs
White LEDs
SiC Substrate
Backside
Metallization
80 x 80 μm
h = 85 μm
Side View
Cathode (-)
Anode (+)
InGaN


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c505rt230-s0200 Summary of contents

Page 1

RazerThin LEDs ® CxxxRT230-S0200 Cree’s RazerThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for blue and green LEDs. These vertically structured LED chips are small in size and require a low forward ...

Page 2

... Electrostatic Discharge Threshold (HBM) Note 2 Electrostatic Discharge Classification (MIL-STD-883E) Typical Electrical/Optical Characteristics at T Part Number Forward Voltage (V Min. C460RT230-S0200 2.7 C470RT230-S0200 2.7 C505RT230-S0200 2.7 C527RT230-S0200 2.7 Mechanical Specifications Description P-N Junction Area (μm) Top Area (μm) Bottom Area (μm) Chip Thickness (μm) Au Bond Pad Diameter (μm) Au Bond Pad Thickness (μ ...

Page 3

... CPR3CO Rev. A C460RT230-S0200 C460RT230-0203 C460RT230-0204 C460RT230-0201 C460RT230-0202 455 nm 460 nm Dominant Wavelength C470RT230-S0200 C470RT230-0203 C470RT230-0204 C470RT230-0201 C470RT230-0202 465 nm 470 nm Dominant Wavelength C505RT230-S0200 C505RT230-0205 C505RT230-0206 C505RT230-0203 C505RT230-0204 C505RT230-0201 C505RT230-0202 500 nm 505 nm Dominant Wavelength C527RT230-S0200 C527RT230-0205 C527RT230-0202 525 nm 530 nm Dominant Wavelength 465 nm 475 nm 510 nm ...

Page 4

... If (mA) Copyright © 2005-2006 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, G•SiC and RazerThin are registered trademarks, and RT230 is a trademark of Cree, Inc. 4 CPR3CO Rev. A 20.0 16.0 12.0 8.0 4.0 0.0 -4 ...

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