ir3508z International Rectifier Corp., ir3508z Datasheet - Page 17

• Manufacturer Part Number: ir3508z
• Description: Xphase3 Phase Ic
• Manufacturer: International Rectifier Corp.

Solder Resist
• The solder resist should be pulled away from the metal lead lands and center pad by a minimum of 0.06mm.
• The minimum solder resist width is 0.13mm. At the inside corner of the solder resist where the lead land
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high aspect
• The 4 vias in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than the
The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all
Non Solder Mask Defined (NSMD). Therefore, pulling the S/R 0.06mm will always ensure NSMD pads.
groups meet, it is recommended to provide a fillet so a solder resist width of ≥ 0.17mm remains.
ratio of the solder resist strip separating the lead lands from the pad land.
diameter of the via.
Page 17 of 19
Jan 09, 2009
IR3508Z