c450da700-0217 Cree, Inc., c450da700-0217 Datasheet - Page 2

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c450da700-0217

Manufacturer Part Number
c450da700-0217
Description
Manufacturer
Cree, Inc.
Datasheet
Notes:
1.
2.
3.
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and DA and DA700 are trademarks of Cree, Inc.
2
Maximum Ratings at T
DC Forward Current
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
Reverse Voltage
Operating Temperature Range
Storage Temperature Range
Typical Electrical/Optical Characteristics at T
Part Number
C450DA700-Sxx000
C460DA700-Sxx000
Mechanical Specifications
Description
P-N Junction Area (μm)
Chip Bottom Area (μm)
Chip Top Area (μm)
Chip Thickness (μm)
AuSn Bond Pad Width – Anode (um)
AuSn Bond Pad Length – Anode (um)
AuSn Bond Pad Width – Cathode (um)
AuSn Bond Pad Length – Cathode (um)
Bond Pad Gap (μm)
AuSn Bond Pad Thickness (μm)
Maximum ratings are package-dependent. The above ratings were determined using a Cree 3.45-mm x 3.45-mm SMT package (with silicone
encapsulation and intrinsic AuSn metal die attach) for characterization. Ratings for other packages may differ. Junction temperature should be
characterized in a specific package to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds).
All products conform to the listed minimum and maximum specifications for electrical and optical characteristics when assembled and operated at 350
mA within the maximum ratings shown above. Efficiency decreases at higher currents. Typical values given are within the range of average values
expected by manufacturer in large quantities and are provided for information only. All measurements were made using lamps in T-1¾ packages (with
Hysol OS4000 epoxy encapsulant and intrinsic AuSn metal die attach). Optical characteristics measured in an integrating sphere using Illuminance E.
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end-product to be
designed in a manner that minimizes the thermal resistance from the LED junction to ambient in order to optimize product performance.
CPR3EU Rev. -
A
= 25°C
Notes 1, 2 & 3
Min.
2.9
2.9
800
700
600
500
400
300
200
100
Forward Voltage (V
0
25
Rth
Rth
Rth
Rth
A
= 25°C, If = 350 mA
j-a
j-a
j-a
j-a
Typ.
= 10 C/W
= 15 C/W
= 20 C/W
= 25 C/W
3.3
3.3
50
f
, V)
Max.
75
3.5
3.5
Ambient Temperature (C)
Note 2
100
Reverse Current
[I(Vr=5V), μA]
125
Max.
2
2
150
175
Dimension
645 x 645
700 x 700
340 x 340
335
645
495
645
75
75
3
CxxxDA700-Sxx000
CxxxDA700-Sxx000
-40°C to +100°C
-40°C to +100°C
Full Width Half Max
1000 mA
750 mA
150°C
5 V
USA Tel: +1.919.313.5300
D
Typ.
, nm)
20
21
Tolerance
Durham, NC 27703
4600 Silicon Drive
±0.5
±35
±35
±35
±25
±15
±35
±35
±35
±15
www.cree.com
Cree, Inc.

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