s29jl064h Meet Spansion Inc., s29jl064h Datasheet - Page 13

• Manufacturer Part Number: s29jl064h
• Description: 64 Megabits 8 M X 8-bits / 4 M X 16-bits
• Manufacturer: Meet Spansion Inc.

7.
September 19, 2007 S29JL064H_00_A7
Ordering Information
The order number is formed by a valid combinations of the following:
Note
For new designs involving Fine-pitch Ball Grid Array (FBGA) packages, S29PL064J supersedes S29JL064H and is the factory recommended
migration path. Please refer to the S29PL-J Data Sheet for specifications and ordering information.
Notes
1. Listed TSOP part numbers describe products based on Copper (Cu) leadframes. Contact your local sales office for products based on
2. Type 0 is standard. Specify other options as required.
3. TSOP package marking omits packing type designator from ordering part number.
4. BGA package marking omits leading S29 and packing type designator from ordering part number.
Device Family
S29JL064H
S29JL064H
Alloy-42 leadframes.
Speed Option
55, 60, 70, 90
55
T
D a t a
A
Package, Material, Set and
Temperature Range
I
S h e e t
00
BAI, BFI
TAI TFI
S29JL064H
S29JL064H Valid Combinations
0
Packing Type
0 = Tray
3 = 13-inch Tape and Reel
Model Number (Additional Ordering Options)
00 = Standard Configuration
Temperature Range
I
Package Material Set
A = Standard
F = Pb-free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package (Not for new designs -
Speed Option
55 = 55 ns
60 = 60 ns
70 = 70 ns
90 = 90 ns
Product Family
S29JL064H: 3.0 Volt-only, 64 Megabit (4 M x 16-Bit/8 M x 8-Bit) Simultaneous
Read/Write Flash Memory Manufactured on 130 nm process technology
= Industrial (–40°C to +85°C)
Model Number
00
Packing Type
0, 3
(Note 2)
TS048
FBE063
(Note 4)
Package Description
(Note 3)
(See
Note))
Fine-pitch
TSOP
BGA
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