fmc49n20t2 Fuji Electric holdings CO.,Ltd, fmc49n20t2 Datasheet - Page 13

• Manufacturer Part Number: fmc49n20t2
• Description: N-channel Enhancement Mode Power Mosfet
• Manufacturer: Fuji Electric holdings CO.,Ltd

Fuji Electric Device Technology Co.,Ltd.
Installation / SMD Package
･ Soldering involves temperatures which exceed the device storage temperature rating. To avoid device
･ T h e h e a t s i n k s h o u l d h a v e a f l a t n e s s w i t h i n ± 3 0 μ m a n d r o u g h n e s s w i t h i n 1 0 μ m. A l s o , k e e p t h e t i g h t e n i n g
･ Improper handling may cause isolation breakdown leading to a critical accident.
･ We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is important to
･ Refer to the following torque reference when mounting the device on a heat sink. Excess torque
damage and to ensure reliability, observe the following guidelines from the quality assurance standard.
torque within the limits of this specification.
evenly apply the compound and to eliminate any air voids.
applied to the mounting screw causes damage to the device and weak torque will increase the
thermal resistance, both of which conditions may destroy the device.
ex.) Over plane off the edges of screw hole. (Recommended plane off the edge is C<1.0mm)
Soldering temperature and duration (SMD Package)
Soldering methods (SMD Package)
◎： Possible
T able 1: Recommended tightening torques.
T-Pack(SJ)
K-Pack(S)
T-Pack(S)
Packages
Peak Temp. & Time
Soldering Temp. &
Package surface
Number of times
TFP
Package style
TO-220F
TO-3PF
TO-3PL
TO-220
TO-247
TO-3P
Time
(Full dipping)
○： Limited to 1 time
Soldering
Wave
×
×
×
×
Screw
M3
M3
M3
(Only terminal)
Soldering
Reflow-Soldering
 230℃， 50sec
 260℃， 10sec
Wave
×
×
×
×
Twice
Tightening torques
×： Unable
30 – 50 Ncm
40 – 60 Ncm
60 – 80 Ncm
Methods
Infrared
Reflow
◎
◎
◎
◎
MS5F6124
Note
flatness : < =±30 m
roughness : <=10 m
Plane off the edges :
Reflow
Air
◎
◎
◎
◎
C<=1.0mm
(Re-work)
Soldering
iron
×
×
×
×
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H04-004-03
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