MC74HC574AFG ON Semiconductor, MC74HC574AFG Datasheet - Page 7

• Manufacturer Part Number: MC74HC574AFG
• Description: IC FLIP FLOP OCT D 3ST 20-SOEIAJ
• Manufacturer: ON Semiconductor
• Series: 74HCr
• Type: D-Type Busr

Specifications of MC74HC574AFG

• Function: Standard
• Output Type: Tri-State Non Inverted
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Frequency - Clock: 35MHz
• Delay Time - Propagation: 27ns
• Trigger Type: Positive Edge
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (5.3mm Width), 20-SO, 20-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SEATING
PLANE
−T−
20
1
20
1
G
18X
20X
E
e
B
0.25
D
F
−A−
M
T
A
S
D
B
20 PL
10
11
10
11
0.25 (0.010)
S
A1
B
N
E
A
A
B
T
PACKAGE DIMENSIONS
SEATING
PLANE
K
M
C
http://onsemi.com
T
CASE 751D−05
CASE 738−03
A
DW SUFFIX
N SUFFIX
SOIC−20
ISSUE G
PDIP−20
ISSUE E
M
7
C
J
L
20 PL
0.25 (0.010)
q
M
M
T
NOTES:
B
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
DIM
A1
A
B
C
D
E
e
H
h
L
q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
12.65
10.05
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
1.27 BSC
0
G
M
A
B
C
D
E
F
J
K
L
N
_
12.95
10.55
1.010
0.240
0.150
0.015
0.050
0.008
0.110
0.020
MAX
MIN
2.65
0.25
0.49
0.32
7.60
0.75
0.90
0.050 BSC
0.100 BSC
0.300 BSC
7
0
INCHES
_
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_