el5001 Intersil Corporation, el5001 Datasheet - Page 6
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el5001
Manufacturer Part Number
el5001
Description
6-channel Clock Driver
Manufacturer
Intersil Corporation
Datasheet
1.EL5001.pdf
(8 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
el5001IREZ
Manufacturer:
INTERSIL
Quantity:
20 000
Typical Performance Curves
FIGURE 15. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT
3.5
2.5
1.5
0.5
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
3
2
1
0
0
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - HTSSOP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
JEDEC JESD51-3 AND SEMI G42-88 (SINGLE
LAYER) TEST BOARD
R
C
V
V
667mW
2.857W
TEMPERATURE
TEMPERATURE
S
S
L
L
=0:
=500pF
=V-=0V
=V+=18V
25
25
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
FIGURE 13. SKEW
50
50
TIME (10ns/DIV)
6
75
75
85
85
MAXIMUM
SKEW=5.0ns
100
100
(Continued)
125
125
150
150
EL5001
FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT
-100
-150
-200
-250
-300
150
100
-50
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
2.5
1.5
0.5
FIGURE 14. INPUT CURRENT vs VOLTAGE
50
0
1
0
3
2
1
0
-2
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
800mW
2.500W
R
C
TEMPERATURE
TEMPERATURE
L
L
-1
=0:
=500pF
25
25
0
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
1
50
50
2
V
IN
75
75
3
(V)
85
85
4
100
100
5
6
125
125
January 31, 2005
7
150
150
8
FN7376.2