nb6l72m ON Semiconductor, nb6l72m Datasheet - Page 3

• Manufacturer Part Number: nb6l72m
• Description: 2.5v / 3.3v Differential 2 X 2 Crosspoint Switch With Cml Outputs
• Manufacturer: ON Semiconductor

1. In the differential configuration when the input termination pin (VTDn) are connected to a common termination voltage or left open, and if
2. All V
Table 2. PIN DESCRIPTION
VTD0
Pin
SEL0
10
12
13
14
15
16
11
1
2
3
4
5
6
7
8
9
-
no signal is applied on Dn/Dn input, then the device will be susceptible to self-oscillation.
D0
D0
Figure 2. Pin Configuration (Top View)
CC
1
2
3
4
Name
VTD0
VTD1
SEL0
SEL1
GND
GND
V
V
and GND pins must be externally connected to a power supply for proper operation.
Q1
Q1
Q0
Q0
EP
D0
D0
D1
D1
CC
CC
VTD1
GND
16
5
NB6L72M
15
Q0
D1
LVTTL,LVCMOS
LVTTL,LVCMOS
6
LVCMOS, Input
LVCMOS, Input
LVCMOS, Input
LVCMOS, Input
LVPECL, CML,
LVPECL, CML,
LVPECL, CML,
LVPECL, CML,
LVDS, LVTTL,
LVDS, LVTTL,
LVDS, LVTTL,
LVDS, LVTTL,
CML Output
CML Output
CML Output
CML Output
Q0
14
D1 SEL1
Input
Input
7
I/O
-
-
-
-
-
-
-
V
13
8
CC
Exposed Pad (EP)
12
10
11
9
Select Logic Input control that selects D0 or D1 to output Q0. See Table 1, Select Input
Function Table. Pin defaults HIGH when left open
Noninverted Differential Input. Note 1
Inverted Differential Input. Note 1
Internal 50 W Termination Pin. Note 1.
Internal 50 W termination pin. Note 1.
Noninverted Differential Input. Note 1.
Inverted Differential Input. Note 1
Select Logic Input control that selects D0 or D1 to output Q1. See Table 1, Select Input
Function Table. Pin defaults HIGH when left open
Negative Supply Voltage
Inverted Differential Output. Typically Terminated with 50 W Resistor to V
Noninverted Differential Output. Typically Terminated with 50 W Resistor to V
Positive Supply Voltage
Positive Supply Voltage
Inverted Differential Reset Input. Typically Terminated with 50 W Resistor to V
Noninverted Differential Reset Input. Typically Terminated with 50 W Resistor to V
Negative Supply Voltage
The Exposed Pad (EP) on the QFN-16 package bottom is thermally connected to the die for
improved heat transfer out of package. The exposed pad must be attached to a heat-sinking
conduit. The pad is not electrically connected to the die, but is recommended to be
electrically and thermally connected to GND on the PC board.
V
Q1
Q1
GND
CC
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NB6L72M
3
Table 1. INPUT/OUTPUT SELECT TRUTH TABLE
*Defaults HIGH when left open
SEL0*
H
H
L
L
Description
SEL1*
H
H
L
L
Q0
D0
D1
D0
D1
CC
.
CC
CC
.
.
CC
Q1
D0
D0
D1
D1
.